Новини

Electromagnetic Compatibility (EMC) is an essential aspect of designing, manufacturing, and using electronic devices. To ensure consistent standards and minimize electromagnetic interference within the European Union, a series of regulations concerning EMC have been introduced. Here is an overview of the main regulations and EMC standards in the European Union:

Explosion-proof signaling tower equipped with universal and energy-saving LED lighting with vertically and horizontally cut lenses. The lenses and body are made of polycarbonate with properties resistant to difficult conditions.

The current imbalance during module operation can be caused both by the characteristics of the paralleled power modules, such as the different forward voltage and by the design of the power converter itself. The interface of power modules, such as power connection on DC and AC side, the design of gate driver, and the gate driver connection to the power modules, have an influence on static and dynamic current imbalance of modules connected in parallel. An overview of the various factors that...

Applications such as small drives (in the range of 100W output power) have certain special requirements with regards to the design of the power supply unit. The power supply unit encompasses the power semiconductor module and the associated peripheries (such as gatedrive, control, protection and heatsink) which are assembled using a single PCB. This unit must be able to deliver the highest possible efficiency and must offer a high degree of compactness. Additionally, it is expected that the...

Electromagnetic interference refers to unwanted electromagnetic signals that can affect the operation of electronic devices and systems. They come in various forms such as radio waves, electromagnetic pulses, electrical surges, or conducted disturbances.

Industrial IGBT Modules are used in various fields of applications. All those applications require compact power modules with high power density, high reliability and high efficiency with reasonable cost. To fulfill all these requirements, the 7th Gen. NX-type IGBT Modules based on SLC-Technology have been developed. The 7th Gen. IGBT, which is based on CSTBT™ concept, provides high efficiency by the reduction of dynamic and static losses [2]. The loss reduction is the first step to realize a...

Electromagnetic Compatibility (EMC) is a field of science and engineering that deals with preventing electromagnetic interference and ensuring that electronic devices and systems can operate alongside each other without mutual electromagnetic interference. In short, EMC concerns the ability of devices to function in environments with various sources of electromagnetic disturbances and minimize their impact on other devices.

As a consequence the employment of reverse conducting IGBT chips save space and that resulted in the new package of the SLIMDIP being designed very compact. The SLIMDIP provides protection functions for under voltage, short circuit and over temperature as well as a linear output signal for the case temperature. The interface circuit of the SLIMDIP is 3,3V to 5V compliant and the pin terminal assignment simplifies the printed circuit board layout design.

The 7th gen. 650V and 1200V class Industrial IGBT modules have been introduced recently to the market. In this new IGBT module generation, the latest chip technology has been utilized [1] to cover the requirements of industrial power electronics applications. All those applications utilize the superior characteristics of the 7th gen NX-Type IGBT modules which are - compactness, high power density, high reliability, high efficiency and reasonable cost [2]. To expand the area of applicability...

RAFI tactile switches are high-quality and innovative switching solutions that are widely used in various fields and industries. These are electromechanical components that allow human interaction with electronic devices by pressing their surfaces.

With this approach, relatively large and complex PCB designs are required to meet all of the spacing and layout requirements of the drivers and discrete power devices combination. Another equally perplexing problem is maintaining consistent performance and reliability when the characteristics of the drivers and power devices are not properly matched. An alternative solution to these problems is to use an integrated power module that contains all the required power devices along with matched...

The 7th gen. NX-type IGBT modules in the 650V, the 1200V and the 1700V categories have been developed in a comprehensive line-up to provide the best solution for different power classes. The new CIB (Converter Inverter Brake) modules which have been recently developed and the 800A / 1200V half bride module will further extend the line-up. The 7th gen. NX-type IGBT modules and the G1-series IPMs are based on the SLC package technology offering a remarkable advancement in the level of the...

In the second half of the 1990s, development and commercialization of IGBT power modules for high voltage ratings as 2500 V and 3300 V has started. Originally, these HV-IGBTs were designed as GTO replacement for high-power and high-reliability applications like for example railway traction inverters [1]. Additionally, the use in many other high-power applications has followed.

Power module performance affects the overall efficiency of the power electronic system. Accordingly, power modules have to be carefully chosen for a given application depending on various electrical and thermal performance parameters. Mitsubishi Electric had launched the latest 7th generation industrial IGBT modules in the 650 V and 1200 V classes [1]. These modules have already been well accepted by the market due to the advantages with regards to the key system requirements: high power...

Each CIB module consists of an integrated 3 phase inverter part, a converter (3 ph diode rectifier) part and a brake chopper part. The line-up of the latest NX7 CIB modules is shown in Figure 1. The NX7 CIB modules utilize the latest 7th generation CSTBT™ IGBT along with the RFC (Relaxed Field of Cathode) diodes. The electrical characteristics of the new thin wafer 7th generation chips have been tuned for the reduction of overall power losses.

A wide motor power range up to 15 kW for different motor voltages is covered by the DIPIPM™ product family. These products are now used in numerous applications such as servo and standard drives, air conditioning systems, refrigerators, fans and washing machines.

Applications like wind energy converters, central photovoltaic inverters and industrial drives require power modules with the highest power density, high reliability, and scalable power ranges with a standardized outline in the voltage classes of 1200V and 1700V. To fulfill such requirements, the LV100 power module is based on same outline and internal layout concept as the well-known HVIGBT LV100 module. This concept is convincing because it is based on a standardized package outline while...

In general a problem occurs when 3-level NPC topologies are developed using several standard half bridge power modules. A series connection of IGBT modules results in high stray inductances which in combination with high switching di/dt cause high switching overvoltages [2]. IGBT modules with an integrated NPC topology phase-leg containing 4 IGBT and 6 diodes potentially have lower stray inductances but are not available for high current ratings and are more expensive due to the complex...