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Трябва да сте влезли в
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Features
• High bond strength to a variety of surfaces
• Double-sided, pressure-sensitive adhesive tape
• High performance, thermally conductive acrylic adhesive
• Can be used instead of heat-cure adhesive, screw mounting or clip mounting
Applications
• Mount heat sink onto BGA graphic processor or drive processor
• Mount heat spreader onto power converter PCB or onto motor control PCB
Specifications
Thickness: 0.005/0.008/0.011" (0.127/0.203/0.279mm)
Reinforcement Carrier: Fiberglass
Dielectric Breakdown Voltage (Vac):3000/6000/8500
Thermal Conductivity: 0.8W/m-K
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Трябва да сте влезли
Features
• High bond strength to a variety of surfaces
• Double-sided, pressure-sensitive adhesive tape
• High performance, thermally conductive acrylic adhesive
• Can be used instead of heat-cure adhesive, screw mounting or clip mounting
Applications
• Mount heat sink onto BGA graphic processor or drive processor
• Mount heat spreader onto power converter PCB or onto motor control PCB
Specifications
Thickness: 0.005/0.008/0.011" (0.127/0.203/0.279mm)
Reinforcement Carrier: Fiberglass
Dielectric Breakdown Voltage (Vac):3000/6000/8500
Thermal Conductivity: 0.8W/m-K