![Hi-Flow 225F-AC термосърдист материал Hi-Flow 225F-AC термосърдист материал](https://www.dacpol.eu/20124-large_default/hi-flow-225f-ac-termosrdist-material.jpg)
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Трябва да сте влезли в
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Features
• Thermal impedance: 0.10°C-in2/W (@25 psi)
• Can be manually or automatically applied to the surfaces of a roomtemperature heat sink
• Foil reinforced, adhesive-coated
• Soft, thermally conductive 55°C phase change compound
Applications
• Computers and peripherals
• Power conversion
• High performance computer processors
• Power semiconductors
• Power modules
Specifications
Thickness: 0.004" (0.102mm)
Reinforcement Carrier: Aluminum
Continuous Use Temp: 120°C
Thermal Conductivity: 1.0 W/m-K
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Трябва да сте влезли
Features
• Thermal impedance: 0.10°C-in2/W (@25 psi)
• Can be manually or automatically applied to the surfaces of a roomtemperature heat sink
• Foil reinforced, adhesive-coated
• Soft, thermally conductive 55°C phase change compound
Applications
• Computers and peripherals
• Power conversion
• High performance computer processors
• Power semiconductors
• Power modules
Specifications
Thickness: 0.004" (0.102mm)
Reinforcement Carrier: Aluminum
Continuous Use Temp: 120°C
Thermal Conductivity: 1.0 W/m-K