

Трябва да сте влезли в
Category
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Features
• Thermal impedance: 0.61°C-in2/W (@50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface material solution
Applications
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Specifications
Thickness: 0.009" (0.229mm)
Dielectric Breakdown Voltage (Vac): 5500
Thermal Conductivity: 1.6 W/m-K
Construction: Silicone/Fiberglass
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Трябва да сте влезли
Features
• Thermal impedance: 0.61°C-in2/W (@50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface material solution
Applications
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Specifications
Thickness: 0.009" (0.229mm)
Dielectric Breakdown Voltage (Vac): 5500
Thermal Conductivity: 1.6 W/m-K
Construction: Silicone/Fiberglass
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