![Серия AXP-100 B Серия AXP-100 B](https://www.dacpol.eu/9291-large_default/seriya-axp-100-b.jpg)
![Серия AXP-100 B Серия AXP-100 B](https://www.dacpol.eu/9291-large_default/seriya-axp-100-b.jpg)
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The new design with its non-inductive thick film Metal Oxide Technology prevents potential problems with clearance and creeping distance from terminal to base plate by means of flexible connecting leads. This unique design allows you to use this elements in the following areas: variable speed drives, power supplies, control devices, telecommunications, robotics, motor controls and other switching devices. Features
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The new design with its non-inductive thick film Metal Oxide Technology prevents potential problems with clearance and creeping distance from terminal to base plate by means of flexible connecting leads. This unique design allows you to use this elements in the following areas: variable speed drives, power supplies, control devices, telecommunications, robotics, motor controls and other switching devices. Features
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