![Plastová tepelná výplňová gap plniva 1000 Plastová tepelná výplňová gap plniva 1000](https://www.dacpol.eu/20121-large_default/plastova-tepelna-vyplnova-gap-plniva-1000.jpg)
![Plastová tepelná výplňová gap plniva 1000 Plastová tepelná výplňová gap plniva 1000](https://www.dacpol.eu/20121-large_default/plastova-tepelna-vyplnova-gap-plniva-1000.jpg)
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Features
• Ultra-conforming, designed for fragile and low-stress applications
• Ambient and accelerated cure schedules
• 100% solids - no cure by-products
• Excellent low and high temperature mechanical and chemical stability
Applications
• Automotive electronics
• Computers and peripherals
• Telecommunications
• Thermally conductive vibration dampening
• Between any heat-generating semiconductor and a heat sink
Specifications
Density (g/cc): 1.6
Hardness (Shore 00): 30
Dielectric Strength (V/mil): 500
Thermal Conductivity: 1.0W/m-K
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musíš být přihlášen
Features
• Ultra-conforming, designed for fragile and low-stress applications
• Ambient and accelerated cure schedules
• 100% solids - no cure by-products
• Excellent low and high temperature mechanical and chemical stability
Applications
• Automotive electronics
• Computers and peripherals
• Telecommunications
• Thermally conductive vibration dampening
• Between any heat-generating semiconductor and a heat sink
Specifications
Density (g/cc): 1.6
Hardness (Shore 00): 30
Dielectric Strength (V/mil): 500
Thermal Conductivity: 1.0W/m-K