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Category
Montaż urządzeń
Modernizacja induktorów
Urządzenia indukcyjne
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Features
• Designed to replace mechanical fasteners or screws
• For applications that require electrical isolation
• Double-sided pressure sensitive adhesive tape
Applications
• Heat sink onto BGA processor
• Heat sink onto drive processor
• Heat spreader onto power converter PCB
• Heat spreader onto motor control PCB
Specifications
Thickness: 0.0055" (0.14mm)
Reinforcement Carrier: Film
Dielectric Breakdown Voltage (Vac): 7000
Thermal Conductivity: 0.4W/m-K
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Sie müssen eingeloggt sein
Features
• Designed to replace mechanical fasteners or screws
• For applications that require electrical isolation
• Double-sided pressure sensitive adhesive tape
Applications
• Heat sink onto BGA processor
• Heat sink onto drive processor
• Heat spreader onto power converter PCB
• Heat spreader onto motor control PCB
Specifications
Thickness: 0.0055" (0.14mm)
Reinforcement Carrier: Film
Dielectric Breakdown Voltage (Vac): 7000
Thermal Conductivity: 0.4W/m-K
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