Doppelkomponentenharz U4720 + D72, Polymerisation bei Umgebungstemperatur
  • Doppelkomponentenharz U4720 + D72, Polymerisation bei Umgebungstemperatur

Fotos dienen nur zu Informationszwecken.

please use latin characters

Hersteller: SEG

Doppelkomponentenharz U4720 + D72, Polymerisation bei Umgebungstemperatur

Application:
Half hard system is used for electronic flooding.
- transformers,
- PCB,
- Electronic components flooding.

Description:
It is excellent resin with very good physical and electrical preferences. It is self - extinguished, and its compatible with insulation system class B.

Storage conditions:
We recommend:
- Storage away from light source, heat or cold, in the closed original container.
- PRODUCT HIGHLY SENSITIVE FOR HUMIDITY,
- storage time: 6 months in temperature
  10°C - 25°C.
For hardener: 12 months in temperature 5°C - 30°C,
- usage:open in ambient temperature

Hygiene and protection:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Packing:
- in containers 1, 5 i 20 kg and barrels 220 kg,
- part B is delivered in corresponding proportion to part A.

 
Preliminary polymer part A Hardener part B
viscosity @ 30°C NSEG0013 25000 ± 6000 mPas viscosity @ 30°C NSEG0013 70 ± 20 mPas
Volume weight ISO 2811 1,61 g/ml Volume weight ISO 2811  
Colour   black Colour   brown
MIXTURE A + B
Mixture weight ratio   100/19 ± 1
Mixture volume ratio   79/21
Insert content   55 %
viscosity @ 23°C NSEG0013 6500 ± 1500 mPas
Volume weight ISO 2811 1,50 g/ml
lifetime NSEG0005 - min
Gelation time @ 23°C 150g NSEG0008 240 min
Gelation time @ 78°C NSEG0012 14 ± 0,4 min
Exothermic temperature 50g NSEG0007 27 °C
Exothermic temperature 100g NSEG0007 28 °C
Exothermic temperature 150g NSEG0007 29 °C
 
Polymerisation
W20°C NSEG0010 7h30min
W20°C NSEG0010 1h45min
Mechanical properties
Line shrinkage ISO3521  
Break off resistance ISO R 527 33,6 daN/cm2
Lengthening during break off ISO R 527 21,7%
Shore hardness A/D @ 23°CC ISO 868 80 A
Electrical properties
Dielectric withstand CEI 243 17kV/mm
Dielectric constant @ 23°C CEI 250 7 (50Hz)
Tgd przy 23°C CEI 250 8,53 x 10-3 (50Hz)
 
Thermal properties
Constant operation temperature   -50+125°C
Thermal conductance   W/m.°C
Glassy transformation   °C
Self - extinguished SEG V0 4mm

Senden Sie eine Anfrage

Interessieren Sie sich für dieses Produkt? Benötigen Sie zusätzliche Informationen oder individuelle Preise?

Kontaktiere uns
FRAGEN SIE NACH DEM PRODUKT close
Vielen Dank für die Zusendung Ihrer Nachricht. Wir werden so schnell wie möglich antworten.
FRAGEN SIE NACH DEM PRODUKT close
Durchsuche

Zur Wunschliste hinzufügen

Sie müssen eingeloggt sein

Application:
Half hard system is used for electronic flooding.
- transformers,
- PCB,
- Electronic components flooding.

Description:
It is excellent resin with very good physical and electrical preferences. It is self - extinguished, and its compatible with insulation system class B.

Storage conditions:
We recommend:
- Storage away from light source, heat or cold, in the closed original container.
- PRODUCT HIGHLY SENSITIVE FOR HUMIDITY,
- storage time: 6 months in temperature
  10°C - 25°C.
For hardener: 12 months in temperature 5°C - 30°C,
- usage:open in ambient temperature

Hygiene and protection:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Packing:
- in containers 1, 5 i 20 kg and barrels 220 kg,
- part B is delivered in corresponding proportion to part A.

 
Preliminary polymer part A Hardener part B
viscosity @ 30°C NSEG0013 25000 ± 6000 mPas viscosity @ 30°C NSEG0013 70 ± 20 mPas
Volume weight ISO 2811 1,61 g/ml Volume weight ISO 2811  
Colour   black Colour   brown
MIXTURE A + B
Mixture weight ratio   100/19 ± 1
Mixture volume ratio   79/21
Insert content   55 %
viscosity @ 23°C NSEG0013 6500 ± 1500 mPas
Volume weight ISO 2811 1,50 g/ml
lifetime NSEG0005 - min
Gelation time @ 23°C 150g NSEG0008 240 min
Gelation time @ 78°C NSEG0012 14 ± 0,4 min
Exothermic temperature 50g NSEG0007 27 °C
Exothermic temperature 100g NSEG0007 28 °C
Exothermic temperature 150g NSEG0007 29 °C
 
Polymerisation
W20°C NSEG0010 7h30min
W20°C NSEG0010 1h45min
Mechanical properties
Line shrinkage ISO3521  
Break off resistance ISO R 527 33,6 daN/cm2
Lengthening during break off ISO R 527 21,7%
Shore hardness A/D @ 23°CC ISO 868 80 A
Electrical properties
Dielectric withstand CEI 243 17kV/mm
Dielectric constant @ 23°C CEI 250 7 (50Hz)
Tgd przy 23°C CEI 250 8,53 x 10-3 (50Hz)
 
Thermal properties
Constant operation temperature   -50+125°C
Thermal conductance   W/m.°C
Glassy transformation   °C
Self - extinguished SEG V0 4mm
Kommentare (0)
*/ -->