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Montaż urządzeń
Modernizacja induktorów
Urządzenia indukcyjne
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Objective: To heat the stainless-steel substrate of a solar panel shingle in order to melt the polymer encapsulant, allowing two shingles to bond together with a 3-inch (76.2 mm) overlap.
Equipment: Ambrell EASYHEAT 1.2 kW, 150-400 kHz solid state induction power supply with a workhead and coil specifically designed for this application.ania.
Frequency: 166 kHz
Material: 3" (76.2 mm) by 10.25" (260.4 mm) section of a 21" (533.4 mm) solar panel shingle
Temperature: 266 °F (130 °C)
Testing: Stationary heating, with the coil located on the topside of the sample, was utilized to achieve uniform melt and adhesion. The shingles were overlapped according to requirements and placed on wood to simulate the installation on a roofing surface. In addition, pressure was applied by pressing the water-cooled coil against the shingle to facilitate the bonding. Tests were performed at several time-voltage settings. Testing resulted in excellent bond formation with the absence of encapsulant bubbling and only slight surface texture change.
Benefits:
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Objective: To heat the stainless-steel substrate of a solar panel shingle in order to melt the polymer encapsulant, allowing two shingles to bond together with a 3-inch (76.2 mm) overlap.
Equipment: Ambrell EASYHEAT 1.2 kW, 150-400 kHz solid state induction power supply with a workhead and coil specifically designed for this application.ania.
Frequency: 166 kHz
Material: 3" (76.2 mm) by 10.25" (260.4 mm) section of a 21" (533.4 mm) solar panel shingle
Temperature: 266 °F (130 °C)
Testing: Stationary heating, with the coil located on the topside of the sample, was utilized to achieve uniform melt and adhesion. The shingles were overlapped according to requirements and placed on wood to simulate the installation on a roofing surface. In addition, pressure was applied by pressing the water-cooled coil against the shingle to facilitate the bonding. Tests were performed at several time-voltage settings. Testing resulted in excellent bond formation with the absence of encapsulant bubbling and only slight surface texture change.
Benefits:
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