XGR SnapShot PCB Screens

REVOLUTIONARY PCB-LEVEL SHIELDING ENCLOSURES ENSURING MAXIMUM PERFORMANCE AND TOTAL DESIGN FLEXIBILITY - XGR SnapShot

SnapShot® EMI shielding enclosures are revolutionary single- or multi-compartment shields that address many challenges associated with existing shielding technologies. The lightweight, metallized plastic material is thermoformed into virtually any design and offers excellent shielding performance compared to perforated or metal cans with a frame and cover.

SnapShot features an excellent design. It is a lightweight metallized plastic with a revolutionary “snap-in-place” system. Metallized plastic:

• Conductive outer surface (tin)

• Non-conductive inner surface (PEI)

Polyetherimide

Tin Coating

Snap-in mounting on solder balls:

• Manual or automated soldering using installation tools

• Creates a strong electromechanical connection

Typical Properties of SnapShot® EMI Shields

FEATURES AND BENEFITS

Design Flexibility

Each application is custom-made to meet unique size and shape requirements of the shielding enclosure layout.

PCB shields are thermoformed into virtually any shape:

• The shield can have multiple compartments in one configuration

• Different PCB shield heights are possible within one configuration

• Low profile with virtually zero clearance between components and the inner shield surface

• With or without surface perforations

• Excellent shielding capability for edge connectors

Exceptional Strength and Durability:

SnapShot shielding enclosures have undergone shock, vibration, humidity, and aging tests, making SnapShot EMC shields ideal for industrial and military electronics:

• Mechanical Shock (OEDEC JESD 22-B104-B)

• Impact (IEC 60668-2-29)

• Vibration (IEC 60068-2-64)

• Thermal Shock (MIL-STD-883CA)

• Dry Thermal Aging

• Humid Heat Aging

Installation After Reflow Soldering Process

Easy installation after reflow allows free inspection and rework.

| Allows manual removal and replacement without damaging the board and without the need for re-soldering.

| Simple BGA attachment mechanism using solder balls as individual mechanical snaps.

| Enables automated optical inspection.

SnapShot® Shield Installed After Reflow

Perfect for weight-sensitive applications. The specialized thermoplastic material is extremely lightweight. The thin, non-ferrous polymer is tin-metallized on the outer surface.

High Shielding Effectiveness

SnapShot® outperforms competitive options in shielding effectiveness from below 1 GHz to 12 GHz. Extremely consistent isolation across a wide frequency range. The non-conductive inner surface reduces electromagnetic coupling with circuit traces, minimizes total volume, and eliminates short-circuit risk.

Relative Shielding Effectiveness of XGR SnapShot EMI Shields Compared to Traditional Metal Cans (10 dB per section)

Solder Balls for SnapShot PCB Shields

SnapShot shielding solder balls are supplied in tape-and-reel packaging. These solder balls can be used on standard SMT equipment and are RoHS and REACH compliant.