19-inch technology
  • 19-inch technology

Photos are for informational purposes only. View product specification

please use latin characters

Manufacturer: HEITEC AG

19-inch technology

19-INCH PACKAGING SYSTEM

 

Overview of standards

Designs for electronic systems (dimensions for 19-inch design)
IEC 60297-3-100 Basic dimensions of front panels, subracks, rack-mount systems, racks and cabinets
IEC 60297-3-101 Subracks and assembly modules
IEC 60297-3-102 Injector/extractor handle
IEC 60297-3-103 Keying and guide pin
IEC 60297-3-104 Connector dependent interface dimensions of subracks and assembly modules
IEC 60297-3-105 Dimensions and layout of 1 U high rack-mount systems
IEC 60297-3-106 Adaptation dimensions for subracks and rack-mount systems applicable with metric cabinets
or racks in accordance with IEC 60917-2-1

Environmental conditions for designs as per IEC 60917, IEC 60297
DIN EN 61587-1 Climatic and mechanic tests and safety aspects for cabinets, racks, subracks and rackmount
systems
DIN EN 61587-2 Seismic tests for cabinets and racks
DIN EN 61587-3 Electromagnetic shielding performance tests for cabinets and subracks
VG 95373, part 15 Electromagnetic compatibility of equipment
Part 15: Measuring method for coupling and shielding

Safety
IEC 60950-1 Information Technology Equipment – Safety
Part 1: General requirements

Rail
EN 50155 Electronic equipment used on rail vehicles

19-inch technology: dimensional relationships

The 19” packaging system is based on internationally applicable dimensional standards that describe the coordinated, modular system structure. The various parts making up the IEC 60297 series of standards describes the mechanical structure of the system.
The objective of these provisions is to ensure that different devices and modules from all potential manufacturers can be combined and substituted without difficulty.
The 19” packaging system is now used in almost every area of industrial electronics: transportation, energy, IT and industrial control.
More specifically, the 19” packaging system can be divided into the following four levels:
 

Level 1: Printed circuit board

Subrack
height		 PCB height
h - 0.3 mm		 PCB depth (mm)
t - 0.3 mm
100 mm 160 mm 220 mm 280 mm
3 U 100 mm - x x -
6 U 233.35 mm - x x -
9 U 366.70 mm - x x -
x most common dimensions
 
The PCB dimensions are defined on the basis of the eurocard format and are set forth in standard IEC 60297-3-101.
Starting from a height of 100 mm and a depth of 160 mm as the basic dimensions, the height increases by multiples of one height unit (1 U = 44.45 mm) and the depth by multiples of 60 mm.
The table above shows the PCB formats most commonly used.
PCBs are generally 1.6 mm thick. Different, higher values must be coordinated between the user and the manufacturer to arrange suitable guide rails. Standard subrack depths are arranged in accordance with PCB depths of 160, 220 and 280 mm.

Level 2: Module

The IEC 60297-3-101 standard also describes the dimensions of the entire module and associated front panel, together with the screw fixing points. The following table shows the most common dimensions.
Height H Depth D
Height
units		 3 U 6 U 9 U Depth
units		      
H8 ± 0.15 128.55 261.9 395.25 D1 ± 0.5 175.6 235.6 295.6
H9 ± 0.2 122.5 255.85 389.2 D3 – 0.3 160 180 220
H10 +0 -0.3 100 233.35 366.7 D4 ± 0.4 169.93 229.93 289.93
 

Level 3: Subrack


Height units 3 U 6 U 9 U
H1 ± 0.4 132.55 265.90 399.25
H5 ≥ 112.00 245.35 378.70
H6 ± 0.2 122.50 255.85 389.20
H7 + 0.5 -0 100.20 233.55 366.90

DIN EN 60297-3-101 provides a figure of 482.6 mm (19 inches) for the width of the subrack front.
The maximum subrack height is given as a multiple of one height unit (1 U), or 44.45 mm. This ensures that the subrack height is coordinated with the height of the plug-in units used. Typical sizes are 3 U, 6 U and 9 U (refer to table).
The installation space for the modules is divided into horizontal pitch units (HP) of 5.08 mm (0.2 inch), or 84 HP for a subrack width of 19 inches.
 

Level 4: 19-inch cabinet

The IEC 60297-3-100 standard describes the basic dimensions of the 19-inch cabinet.
Here, too, the space available to fit the subracks is divided into multiples of 1 U.
The installation space must be at least 450 mm wide.
 

Backplane


Backplane with plug connector as per DIN 41612/IEC 60603-2 and IEC 61076-4-113
Typical application: VME/VME64 systems
 
Backplane with plug connector as per IEC 61076-4-101
Typical application: CPCI systems
 
The IEC 60297-3-104 standard describes the dimensions of the backplanes for the most common height variations (refer to table).
Height units 3 U 6 U 9 U
H6 ± 0.2 122.50 255.85 389.20
H8 ± 0.15 128.55 261.90 395.25
 

IP protection levels – chassis protection classes (IP code)




  Protection against solid objects
0 No protection
1 Protected against solid objects over 50 mm in diameter
2 Protected against solid objects over 12.5 mm in diameter
3 Protected against solid objects over 2.5 mm in diameter
4 Protected against solid objects over 1.0 mm in diameter
5 Protected against dust (limited ingress, no harmful deposit)
6 Totally protected against dust

  Protection against contact
0 No protection
1 Protected against contact with back of hand
2 Protected against contact with fingers
3 Protected against tools
4 Protected against wires
5 Complete protection against contact
6 Complete protection against contact

  Protection against liquid
0 No protection
1 Protected against vertically falling drops of water, e.g. condensation
2 Protected against direct sprays of water up to 15 degrees from vertical
3 Protected against sprays up to 60 degrees from vertical
4 Protected against water sprayed from all directions
5 Protected against low-pressure jets of water from all directions
6 Protected against strong jets of water
7 Protected against the effects of short-term immersion
8 Protected against long periods of immersion
 

Electromagnetic compatibility (EMC)



 
EMC (electromagnetic compatibility) refers to the ability of an electrical device to function satisfactorily in its electromagnetic environment without influencing this environment more than is admissible. These requirements were taken into account when developing the HEITEC subracks.
They are made entirely from metal and coated with a conductive surface finish.
Stainless steel EMC gaskets ensure a conductive connection between the separate parts.

Testing of measurements of the shielding effectiveness of empty chassis is based on DIN EN 61587-3 or military standards, e.g. MIL STD 285 (US) or VG 95373 Part 15 (GER).
International EMC standards are published mainly by IEC (International Electrotechnical Commission) and CISPR (International Special Committee on Radio Interference).
Key series of EMC standards with global importance: IEC 61000


The above diagram shows the extent to which EMC shielding influences the attenuation of the electromagnetic field. The attenuation of a standard chassis with no suitable EMC components is thus much lower than that of a HeiPac Vario EMC subrack.
Of particular interest is the shielding factor provided by the attenuation.
HF attenuation (dB) Shielding (%)
6 50
20 90
40 99
60 99.9
 

Screws


Screws are used to achieve a tight connection between two or more components. They form part of a screw gear consisting of two standardised, paired components.
Friction on the wedge-shaped thread under load prevents the screws from coming loose.



 

Nuts

Nuts are the counterpart to the screws. They have a standardised inside thread that matches the thread of the screw.
The prismatic outside contour is shaped to accommodate a wrench, which is used to tighten the nut. In terms of dimensions, the height of a nut is approximately half the width across the flats.


Less
Read more

Send an inquiry

Are you interested in this product? Do you need additional information or individual pricing?

Contact us
ASK FOR THE PRODUCT close
Thank you for sending your message. We will respond as soon as possible.
ASK FOR THE PRODUCT close
Browse
send an inquiry

Add to Wishlist

You must be logged in

19-INCH PACKAGING SYSTEM

 

Overview of standards

Designs for electronic systems (dimensions for 19-inch design)
IEC 60297-3-100 Basic dimensions of front panels, subracks, rack-mount systems, racks and cabinets
IEC 60297-3-101 Subracks and assembly modules
IEC 60297-3-102 Injector/extractor handle
IEC 60297-3-103 Keying and guide pin
IEC 60297-3-104 Connector dependent interface dimensions of subracks and assembly modules
IEC 60297-3-105 Dimensions and layout of 1 U high rack-mount systems
IEC 60297-3-106 Adaptation dimensions for subracks and rack-mount systems applicable with metric cabinets
or racks in accordance with IEC 60917-2-1

Environmental conditions for designs as per IEC 60917, IEC 60297
DIN EN 61587-1 Climatic and mechanic tests and safety aspects for cabinets, racks, subracks and rackmount
systems
DIN EN 61587-2 Seismic tests for cabinets and racks
DIN EN 61587-3 Electromagnetic shielding performance tests for cabinets and subracks
VG 95373, part 15 Electromagnetic compatibility of equipment
Part 15: Measuring method for coupling and shielding

Safety
IEC 60950-1 Information Technology Equipment – Safety
Part 1: General requirements

Rail
EN 50155 Electronic equipment used on rail vehicles

19-inch technology: dimensional relationships

The 19” packaging system is based on internationally applicable dimensional standards that describe the coordinated, modular system structure. The various parts making up the IEC 60297 series of standards describes the mechanical structure of the system.
The objective of these provisions is to ensure that different devices and modules from all potential manufacturers can be combined and substituted without difficulty.
The 19” packaging system is now used in almost every area of industrial electronics: transportation, energy, IT and industrial control.
More specifically, the 19” packaging system can be divided into the following four levels:
 

Level 1: Printed circuit board

Subrack
height		 PCB height
h - 0.3 mm		 PCB depth (mm)
t - 0.3 mm
100 mm 160 mm 220 mm 280 mm
3 U 100 mm - x x -
6 U 233.35 mm - x x -
9 U 366.70 mm - x x -
x most common dimensions
 
The PCB dimensions are defined on the basis of the eurocard format and are set forth in standard IEC 60297-3-101.
Starting from a height of 100 mm and a depth of 160 mm as the basic dimensions, the height increases by multiples of one height unit (1 U = 44.45 mm) and the depth by multiples of 60 mm.
The table above shows the PCB formats most commonly used.
PCBs are generally 1.6 mm thick. Different, higher values must be coordinated between the user and the manufacturer to arrange suitable guide rails. Standard subrack depths are arranged in accordance with PCB depths of 160, 220 and 280 mm.

Level 2: Module

The IEC 60297-3-101 standard also describes the dimensions of the entire module and associated front panel, together with the screw fixing points. The following table shows the most common dimensions.
Height H Depth D
Height
units		 3 U 6 U 9 U Depth
units		      
H8 ± 0.15 128.55 261.9 395.25 D1 ± 0.5 175.6 235.6 295.6
H9 ± 0.2 122.5 255.85 389.2 D3 – 0.3 160 180 220
H10 +0 -0.3 100 233.35 366.7 D4 ± 0.4 169.93 229.93 289.93
 

Level 3: Subrack


Height units 3 U 6 U 9 U
H1 ± 0.4 132.55 265.90 399.25
H5 ≥ 112.00 245.35 378.70
H6 ± 0.2 122.50 255.85 389.20
H7 + 0.5 -0 100.20 233.55 366.90

DIN EN 60297-3-101 provides a figure of 482.6 mm (19 inches) for the width of the subrack front.
The maximum subrack height is given as a multiple of one height unit (1 U), or 44.45 mm. This ensures that the subrack height is coordinated with the height of the plug-in units used. Typical sizes are 3 U, 6 U and 9 U (refer to table).
The installation space for the modules is divided into horizontal pitch units (HP) of 5.08 mm (0.2 inch), or 84 HP for a subrack width of 19 inches.
 

Level 4: 19-inch cabinet

The IEC 60297-3-100 standard describes the basic dimensions of the 19-inch cabinet.
Here, too, the space available to fit the subracks is divided into multiples of 1 U.
The installation space must be at least 450 mm wide.
 

Backplane


Backplane with plug connector as per DIN 41612/IEC 60603-2 and IEC 61076-4-113
Typical application: VME/VME64 systems
 
Backplane with plug connector as per IEC 61076-4-101
Typical application: CPCI systems
 
The IEC 60297-3-104 standard describes the dimensions of the backplanes for the most common height variations (refer to table).
Height units 3 U 6 U 9 U
H6 ± 0.2 122.50 255.85 389.20
H8 ± 0.15 128.55 261.90 395.25
 

IP protection levels – chassis protection classes (IP code)




  Protection against solid objects
0 No protection
1 Protected against solid objects over 50 mm in diameter
2 Protected against solid objects over 12.5 mm in diameter
3 Protected against solid objects over 2.5 mm in diameter
4 Protected against solid objects over 1.0 mm in diameter
5 Protected against dust (limited ingress, no harmful deposit)
6 Totally protected against dust

  Protection against contact
0 No protection
1 Protected against contact with back of hand
2 Protected against contact with fingers
3 Protected against tools
4 Protected against wires
5 Complete protection against contact
6 Complete protection against contact

  Protection against liquid
0 No protection
1 Protected against vertically falling drops of water, e.g. condensation
2 Protected against direct sprays of water up to 15 degrees from vertical
3 Protected against sprays up to 60 degrees from vertical
4 Protected against water sprayed from all directions
5 Protected against low-pressure jets of water from all directions
6 Protected against strong jets of water
7 Protected against the effects of short-term immersion
8 Protected against long periods of immersion
 

Electromagnetic compatibility (EMC)



 
EMC (electromagnetic compatibility) refers to the ability of an electrical device to function satisfactorily in its electromagnetic environment without influencing this environment more than is admissible. These requirements were taken into account when developing the HEITEC subracks.
They are made entirely from metal and coated with a conductive surface finish.
Stainless steel EMC gaskets ensure a conductive connection between the separate parts.

Testing of measurements of the shielding effectiveness of empty chassis is based on DIN EN 61587-3 or military standards, e.g. MIL STD 285 (US) or VG 95373 Part 15 (GER).
International EMC standards are published mainly by IEC (International Electrotechnical Commission) and CISPR (International Special Committee on Radio Interference).
Key series of EMC standards with global importance: IEC 61000


The above diagram shows the extent to which EMC shielding influences the attenuation of the electromagnetic field. The attenuation of a standard chassis with no suitable EMC components is thus much lower than that of a HeiPac Vario EMC subrack.
Of particular interest is the shielding factor provided by the attenuation.
HF attenuation (dB) Shielding (%)
6 50
20 90
40 99
60 99.9
 

Screws


Screws are used to achieve a tight connection between two or more components. They form part of a screw gear consisting of two standardised, paired components.
Friction on the wedge-shaped thread under load prevents the screws from coming loose.



 

Nuts

Nuts are the counterpart to the screws. They have a standardised inside thread that matches the thread of the screw.
The prismatic outside contour is shaped to accommodate a wrench, which is used to tighten the nut. In terms of dimensions, the height of a nut is approximately half the width across the flats.


Less
Read more
Comments (0)