Ferrite cores play a crucial role in eliminating electromagnetic interference (EMI) and optimizing power supply systems. Learn how their magnetic properties influence filtration efficiency and the stability of electronic systems.
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R&D
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Power Supply Optimization: Challenges, Technologies, and Solutions
The article discusses the challenges and technologies used in power supply design on PCBs, which are essential for the development of modern electronic devices. Topics include component miniaturization, heat management, DC-DC converters, AC-DC converters, and voltage regulators. It also covers modern technologies such as graphene, Gallium Nitride (GaN), and cooling technologies that impact energy efficiency and space optimization. The article also addresses challenges related to prototyping...
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Heat Management: The Key to Effective Performance and Reliability of Prototypes
Industrial fans play a key role in heat management in electronic systems, especially in R&D environments. The article discusses types of fans, such as axial, radial, and brushless, and their application in various cooling systems. It highlights the challenges related to component density, noise reduction, and energy consumption. Innovative solutions, including integration with IoT systems, enable dynamic cooling management, supporting R&D projects.
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Application of Liquid Thermal Conductive Materials in the Electronics Industry: Effective Cooling for Performance and Reliability
In today's world, where more and more electronic devices generate significant amounts of heat, efficient cooling becomes a key factor in ensuring the reliability and performance of these systems. In response to this challenge, the electronics industry is increasingly turning to innovative solutions such as liquid thermal conductive materials.
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What are thermal conductive materials?
Thermal conductive materials are substances that efficiently transfer heat, used in various industries such as electronics, automotive, and energy. These include ceramic, metallic, and organic types, which play a crucial role in heat management, enhancing device performance, and advancing modern technologies.
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GeneSiC technology – transistors, modules, chips
In applications from 20 W to 20 MW, and with device voltages from 650 V to 6.5 kV, GeneSiC silicon carbide (SiC) MOSFETs and Schottky MPS™ diodes drive high-speed, high-efficiency power conversion across diverse markets including EV, industrial automation, solar, wind, grid, motor drives and defense. High-volume, high-quality shipments ensure application performance, reliability and uptime availability.
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SiC Schottky MPS™ Diodes
A novel GeneSiC Merged-PiN Schottky design combines the best features from both PiN and Schottky diode structures, producing the lowest forward voltage drop (VF), high surge-current capability (IFSM), and minimized temperature-independent switching losses.
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Czynniki wpływające na wybór materiałów termoprzewodzących: Kluczowe kryteria i wytyczne
Materiały termoprzewodzące są kluczowe w wielu branżach przemysłu, wpływając na efektywność systemów chłodzenia i ogrzewania. Wybór odpowiednich materiałów termoprzewodzących jest niezwykle istotny. Przed podjęciem decyzji warto zwrócić uwagę na następujące czynniki
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Heat management - Challenges for electric vehicles
Thermal management in electric vehicles is crucial for ensuring the efficiency and longevity of components such as batteries and electrical systems. Effective cooling, using specialized thermal materials like gap-filling liquids (GFL) and Softtherm pads, helps optimize performance and extend battery life, which is essential in the context of the development of electromobility and autonomous drive systems.
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Folia samoprzylepna z wypełnieniem ceramicznym
Keratherm © - KL 95 to samoprzylepna folia z wypełnieniem ceramicznym charakteryzująca się dobra przewodnością cieplną.
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Thermally conductive materials in power storages
Technological development caused a need in electric engineering to search for new solutions in heat conduction.