Navitas introduces the latest SiCPAK™ power modules – a new standard of reliability and performance at high temperatures

Navitas introduces the latest SiCPAK™ power modules – a new standard of reliability and performance at high temperatures

Navitas Semiconductor (Nasdaq: NVTS), a leader in the gallium nitride (GaN) and silicon carbide (SiC) semiconductor industry, has announced the launch of its latest SiCPAK™ power modules. These modules feature a modern epoxy resin encapsulation technology that significantly enhances reliability and stability in harsh thermal conditions.

Revolutionary epoxy resin technology – 5x lower thermal resistance increase

The new 1200V SiCPAK™ modules have been designed for high-power applications in extreme environmental conditions. Thanks to the innovative epoxy resin technology, these modules offer a five times lower increase in thermal resistance after 1000 thermal shock cycles (-40°C to +125°C), compared to traditional modules with silicone gel.

All silicon modules failed insulation tests, while SiCPAK™ panels with epoxy encapsulation maintained safe insulation levels, resulting in longer system lifespans and enhanced safety.

Modern MOSFET technology – lower power losses, higher reliability

The SiCPAK™ module series uses the in-house "trench-assisted planar SiC MOSFET" technology from GeneSiC™, which offers:

• 20% lower power losses,
• Less heating, leading to longer component lifespan,
• Exceptional parameter stability at high temperatures.

In practice, this means a lower increase in RDS(ON) resistance as temperature rises, allowing for more efficient and energy-saving operation of devices over a wide temperature range.

Additionally, all SiC MOSFET transistors from GeneSiC™ offer:

• The highest tested avalanche breakdown resistance,
• Up to 30% better short-circuit tolerance,
• Precise threshold voltage tolerance – facilitating parallel connections.

Applications and configurations of SiCPAK™ modules

The new modules are aimed at a wide range of applications:

• Fast DC chargers for electric vehicles (EV DCFC),
• Industrial motor drives,
• UPS power supplies,
• Inverters and power optimizers for photovoltaic installations,
• Energy storage systems (ESS),
• Industrial welders and induction heating devices.

Available configurations: half-bridge, full-bridge, 3L-T-NPC, with resistance ranges from 4.6 mΩ to 18.5 mΩ. All modules feature built-in NTC thermistors and comply with popular press-fit pin standards. A factory-applied thermal interface material (TIM) option is also available to simplify assembly.

About Navitas

Navitas Semiconductor is the world's only company exclusively specializing in next-generation semiconductors, founded in 2014. GaNFast™ and GeneSiC™ solutions enable faster charging, higher power density, and significant energy savings. Applications span AI data centers, electromobility, renewable energy, energy storage, home and industrial appliances, and consumer electronics.

Navitas holds over 300 patents and offers the world’s first 20-year warranty on GaNFast™ chips. The company is also the first semiconductor manufacturer with a CarbonNeutral® certification.

Check out our offering:

• GeneSiC diodes
• GeneSiC transistors