Thermal lifting materials Hi-Flow 565ut
  • Thermal lifting materials Hi-Flow 565ut

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Manufacturer: BERGQUIST

Thermal lifting materials Hi-Flow 565ut

Features
• Thermal impedance: 0.37°C-in2/W (@25 psi)
• Used where electrical isolation is not required
• Low volatility - less than 1%
• Easy to handle in the manufacturing environment

Applications
• Spring or clip mount applications where thermal grease is used
• Microprocessors mounted on a heat sink
• Power semiconductors
• Power conversion modules

Specifications
Thickness: 0.0055" (0.139mm)
Reinforcement Carrier: Aluminum
Continuous Use Temp: 130°C
Thermal Conductivity: 0.9 W/m-K

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Features
• Thermal impedance: 0.37°C-in2/W (@25 psi)
• Used where electrical isolation is not required
• Low volatility - less than 1%
• Easy to handle in the manufacturing environment

Applications
• Spring or clip mount applications where thermal grease is used
• Microprocessors mounted on a heat sink
• Power semiconductors
• Power conversion modules

Specifications
Thickness: 0.0055" (0.139mm)
Reinforcement Carrier: Aluminum
Continuous Use Temp: 130°C
Thermal Conductivity: 0.9 W/m-K

Less
Read more
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