Thermal thermal tile Thermal Clad with Dielectric layer
  • Thermal thermal tile Thermal Clad with Dielectric layer

Photos are for informational purposes only. View product specification

please use latin characters

Manufacturer: BERGQUIST

Thermal thermal tile Thermal Clad with Dielectric layer

Termoprzewodząca płytka PCB Thermal Clad

Thermal Clad is a versatile substrate allowing circuit boards to be configured for shapes, bends and multiple thicknesses. In this motor control application, the dielectric has been selectively removed and the metal formed with three-dimensional features.

Additional Thermal Clad benefits:
• Increased power density
• Extend the life of dies
• Improved product thermal and mechanical performance
• Better use of surface mount technology

Anatomy of a Thermal Clad Board:
1. Base layer Copper 0,51 - 4,83 mm oa Aluminium 0,51 - 3,18 mm.
2. Dielectric layer – HPL, HT, LM, MP.
3. Circuit layer – 35 um – 350 um.

Budowa płytki PCB serii Thermal-Clad

Parameters:

Type
Thickness
(10-3in/10-6m)
Impedance
(oC/W)
Conductivity
(W/m-k)
Operating
(VAC)
Breakdown
(kVAC)

HT-04503

3/75
0.45
2.2
120
6.0

HT-07006

6/150
0.70
2.2
960
11.0

LTI-04503

3/75
0.45
2.2
120
6.5

LTI-06005

5/125
0.60
2.2
480
9.5

MP-06503

3/75
0.65
1.3
120
8.5


Porównanie  FR-4 z różnymi wersjami Thermal Clad

Light output of the same LED die on different circuit board materials at a maintained die temperature of 80ºC.

Send an inquiry

Are you interested in this product? Do you need additional information or individual pricing?

Contact us
ASK FOR THE PRODUCT close
Thank you for sending your message. We will respond as soon as possible.
ASK FOR THE PRODUCT close
Browse

Add to Wishlist

You must be logged in

Termoprzewodząca płytka PCB Thermal Clad

Thermal Clad is a versatile substrate allowing circuit boards to be configured for shapes, bends and multiple thicknesses. In this motor control application, the dielectric has been selectively removed and the metal formed with three-dimensional features.

Additional Thermal Clad benefits:
• Increased power density
• Extend the life of dies
• Improved product thermal and mechanical performance
• Better use of surface mount technology

Anatomy of a Thermal Clad Board:
1. Base layer Copper 0,51 - 4,83 mm oa Aluminium 0,51 - 3,18 mm.
2. Dielectric layer – HPL, HT, LM, MP.
3. Circuit layer – 35 um – 350 um.

Budowa płytki PCB serii Thermal-Clad

Parameters:

Type
Thickness
(10-3in/10-6m)
Impedance
(oC/W)
Conductivity
(W/m-k)
Operating
(VAC)
Breakdown
(kVAC)

HT-04503

3/75
0.45
2.2
120
6.0

HT-07006

6/150
0.70
2.2
960
11.0

LTI-04503

3/75
0.45
2.2
120
6.5

LTI-06005

5/125
0.60
2.2
480
9.5

MP-06503

3/75
0.65
1.3
120
8.5


Porównanie  FR-4 z różnymi wersjami Thermal Clad

Light output of the same LED die on different circuit board materials at a maintained die temperature of 80ºC.

Comments (0)
*/ -->