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Features
• Eliminates the need for mechanical fasteners
• One-part formulation for easy dispensing
• Mechanical and chemical stability
• Maintains structural bond in severeenvironment applications
• Heat cure
Applications
• PCBA to housing
• Discrete component to heat spreader
Specifications
Density (g/cc): 2.4
Hardness (Shore A): 80
Dielectric Strength (V/mil): 250
Thermal Conductivity: 2.0W/m-K
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Features
• Eliminates the need for mechanical fasteners
• One-part formulation for easy dispensing
• Mechanical and chemical stability
• Maintains structural bond in severeenvironment applications
• Heat cure
Applications
• PCBA to housing
• Discrete component to heat spreader
Specifications
Density (g/cc): 2.4
Hardness (Shore A): 80
Dielectric Strength (V/mil): 250
Thermal Conductivity: 2.0W/m-K
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