Plastic Thermal Fillers GAP Pad Vo
  • Plastic Thermal Fillers GAP Pad Vo

Photos are for informational purposes only. View product specification

please use latin characters

Manufacturer: BERGQUIST

Plastic Thermal Fillers GAP Pad Vo

Features
• Highly conformable, low hardness
• “Gel-like” modulus
• Designed for low-stress applications
• Puncture, shear and tear resistant

Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader

Specifications
Thickness: 0.020-0.250" (0.508-6.350mm)
Hardness, Bulk Rubber (Shore 00): 5
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.0W/m-K

Send an inquiry

Are you interested in this product? Do you need additional information or individual pricing?

Contact us
ASK FOR THE PRODUCT close
Thank you for sending your message. We will respond as soon as possible.
ASK FOR THE PRODUCT close
Browse

Add to Wishlist

You must be logged in

Features
• Highly conformable, low hardness
• “Gel-like” modulus
• Designed for low-stress applications
• Puncture, shear and tear resistant

Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader

Specifications
Thickness: 0.020-0.250" (0.508-6.350mm)
Hardness, Bulk Rubber (Shore 00): 5
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.0W/m-K

Comments (0)