Two-component resin with E520C + D88 batch, polymerization at ambient temperature
  • Two-component resin with E520C + D88 batch, polymerization at ambient temperature

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Manufacturer: SEG

Two-component resin with E520C + D88 batch, polymerization at ambient temperature

Application:

 Half hard resin is used in electro technical and electronic industry.
- electric material insulation
- flooding delicate electronic components.
Main characteristics:
-two component epoxide resin with insert has good thermal conductance and is compatible with insulation systems class F.

Packing:
- in containers 1, 5 and 20 kg and barrels 220 kg,
- part B is delivered in corresponding proportion to part A..

Storage conditions:
It is recommended to: storage far away from light, heat and cold source, in original closed container. Product is sensitive for humidity. resin can be stored for 4 months in temperature 5-30C and hardener - 12 months in temperature 5-30C.

Application:
Obtain room temperature for 48 hours before usage.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Preliminary polymer part A Hardener part B

viscosity @ 23°C 

  

23000 ± 4500 mPas

viscosity @ 23°C

10 ±2 mPas

  

Reomat

    

Reomat

    

Volume weight

ISO 2811

1.74 g/ml

      

Colour

black/red

        

Mixture A + B

Mixture weight ratio

  

100/13 ± 1

Mixture volume ratio

  

81/19

Insert content

  

53%

viscosity @ 23°C

  

1.74 g/ml

[Reomat]:

  

1500 ±700 mPas

Volume weight

ISO 2811

1.58 g/ml

lifetime  150 g - 23°C

  

260 min

Gelation time @ 23°C - 150 g

  

300 min

Gelation time @ 78°C - 2,5 g

  

6±2 min

Exothermic peak @ 50 g

  

24°C

Exothermic peak @ 100 g

  

24°C

Exothermic peak @ 200 g

  

24°C

Polymersiation

@ 20°C

  

48h

@ 100°C

   1h50 min

Mechanical properties

Line shrinkage

ISO 3521

1,0%
Break off resistance ISO R 527

250 daN/cm2

Lengthening during break off

ISO R 527

16%

Shore hardness A/D @ 23°C

 ISO 868 67D

Dilatation coefficient

  

148 10-6K

Electrical properties

Dielectric withstand

CEI 243

20 kV/mm

Dielectric constant @ 23°C

CEI 250

4,4 [50Hz]

Tg 6 @ 23°C

CEI 250

0,004 [50Hz]
Thermal properties

Constant operation temperature

  

-30°C do 145°C

Thermal conductance

  

0,51 ± 0,1 W/m.°C

Glassy state transformation

  

33°C

Self - extinguished

UL94

 NO

Informacje te są wstępne i mogą ulec zmianie. Wynikają one z prób i naszych długoletnich doświadczeń oraz oparte są na zastosowaniach w przemyśle. Nie mogą one być gwarancją ale są oparte na naszej aktualnej wiedzy i na wynikach otrzymanych w laboratorium. Należy ten wyrób przystosować do swoich potrzeb, ale nie może to pociągać jakichkolwiek zobowiązań lub gwarancji z naszej strony odnośnie zastosowania tego produktu.

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Application:

 Half hard resin is used in electro technical and electronic industry.
- electric material insulation
- flooding delicate electronic components.
Main characteristics:
-two component epoxide resin with insert has good thermal conductance and is compatible with insulation systems class F.

Packing:
- in containers 1, 5 and 20 kg and barrels 220 kg,
- part B is delivered in corresponding proportion to part A..

Storage conditions:
It is recommended to: storage far away from light, heat and cold source, in original closed container. Product is sensitive for humidity. resin can be stored for 4 months in temperature 5-30C and hardener - 12 months in temperature 5-30C.

Application:
Obtain room temperature for 48 hours before usage.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Preliminary polymer part A Hardener part B

viscosity @ 23°C 

  

23000 ± 4500 mPas

viscosity @ 23°C

10 ±2 mPas

  

Reomat

    

Reomat

    

Volume weight

ISO 2811

1.74 g/ml

      

Colour

black/red

        

Mixture A + B

Mixture weight ratio

  

100/13 ± 1

Mixture volume ratio

  

81/19

Insert content

  

53%

viscosity @ 23°C

  

1.74 g/ml

[Reomat]:

  

1500 ±700 mPas

Volume weight

ISO 2811

1.58 g/ml

lifetime  150 g - 23°C

  

260 min

Gelation time @ 23°C - 150 g

  

300 min

Gelation time @ 78°C - 2,5 g

  

6±2 min

Exothermic peak @ 50 g

  

24°C

Exothermic peak @ 100 g

  

24°C

Exothermic peak @ 200 g

  

24°C

Polymersiation

@ 20°C

  

48h

@ 100°C

   1h50 min

Mechanical properties

Line shrinkage

ISO 3521

1,0%
Break off resistance ISO R 527

250 daN/cm2

Lengthening during break off

ISO R 527

16%

Shore hardness A/D @ 23°C

 ISO 868 67D

Dilatation coefficient

  

148 10-6K

Electrical properties

Dielectric withstand

CEI 243

20 kV/mm

Dielectric constant @ 23°C

CEI 250

4,4 [50Hz]

Tg 6 @ 23°C

CEI 250

0,004 [50Hz]
Thermal properties

Constant operation temperature

  

-30°C do 145°C

Thermal conductance

  

0,51 ± 0,1 W/m.°C

Glassy state transformation

  

33°C

Self - extinguished

UL94

 NO

Informacje te są wstępne i mogą ulec zmianie. Wynikają one z prób i naszych długoletnich doświadczeń oraz oparte są na zastosowaniach w przemyśle. Nie mogą one być gwarancją ale są oparte na naszej aktualnej wiedzy i na wynikach otrzymanych w laboratorium. Należy ten wyrób przystosować do swoich potrzeb, ale nie może to pociągać jakichkolwiek zobowiązań lub gwarancji z naszej strony odnośnie zastosowania tego produktu.

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