Two-component resin with E819CA + D91 load, polymerization at room temperature
  • Two-component resin with E819CA + D91 load, polymerization at room temperature

Photos are for informational purposes only. View product specification

please use latin characters

Manufacturer: SEG

Two-component resin with E819CA + D91 load, polymerization at room temperature

Application:
 Half hard resin is used in electro technical and electronic industry.
- Electric material insulation,
- for electronic components flooding.

Main characteristic:
-  two component resin with good thermal conductance and compatible with insulation systems class F.

Storage conditions:
It is recommended to:
- Storage far away from light, heat, cold source, in original closed container.
- product highly sensitive for humidity,
- storage time: 4 months in temperature  10°C - 25°C,
- hardener: 12 months in temperature 5°C - 30°C,
- usage: bring to ambient temperature 48 hours before usage.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Packing:
- in containers 1, 5 and 20 kg and barrels 220 kg,
- part B is delivered in corresponding proportion to part A..

Preliminary polymer part A Hardener part B
viscosity @ 23°C /Reomat NSEG0013 12 600±4 000mPas viscosity @  23°C /Reomat NSEG0013 680 ± 200 mPas
Volume weight ISO 2811   Volume weight ISO 2811 1,00 g/ml
Colour   brown Colour   yellow
Mixture A + B
Mixture weight ratio   100 /13 ± 1
Mixture volume ratio   100/17,7
Insert content   53%
viscosity @ 23°C /Reomat/ NSEG0013 1 800 ± 700 mPas
Volume weight ISO 2811 1,28 g/ml
lifetime 150g @ 23°C NSEG 0005 29 min
Gelation time @ 23° -150 g NSEG 0008 59 min
Gelation time @ 78°- 2,5 g NSEG 0012 7 min 30 s ± 3 min
Exothermic peak @50 g NSEG 0007 30 °C
Exothermic peak @ 100g NSEG 0007 30 °C
Exothermic peak @ 200g NSEG 0007 36 °C
 
Polymerisation
W20°C NSEG 0010  
W60°C NSEG 0010 45 min
 
Mechanical properties
Line shrinkage ISO 3521 < 1.0%
Stretch ISO R 527 210daN/cm2
Lengthen ISO R 527 <4%
Shore hardness A/D @ 23°C ISO 868 60 D
 
Electrical properties
Dielectric withstand CEI 243 20 kV/mm
Dielectric constant @ CEI 250 (50 Hz)
Tg d @ 23°C CEI 250 (50 Hz)
 
Thermal properties
Constant operation temperature   -40+155°C
Thermal conductance   0.60 ±0.1 W/m.°C
Glassy phase   41 °C
Self - extinguished SEG V0 6 mm
Less
Read more

Send an inquiry

Are you interested in this product? Do you need additional information or individual pricing?

Contact us
ASK FOR THE PRODUCT close
Thank you for sending your message. We will respond as soon as possible.
ASK FOR THE PRODUCT close
Browse
send an inquiry

Add to Wishlist

You must be logged in

Application:
 Half hard resin is used in electro technical and electronic industry.
- Electric material insulation,
- for electronic components flooding.

Main characteristic:
-  two component resin with good thermal conductance and compatible with insulation systems class F.

Storage conditions:
It is recommended to:
- Storage far away from light, heat, cold source, in original closed container.
- product highly sensitive for humidity,
- storage time: 4 months in temperature  10°C - 25°C,
- hardener: 12 months in temperature 5°C - 30°C,
- usage: bring to ambient temperature 48 hours before usage.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Packing:
- in containers 1, 5 and 20 kg and barrels 220 kg,
- part B is delivered in corresponding proportion to part A..

Preliminary polymer part A Hardener part B
viscosity @ 23°C /Reomat NSEG0013 12 600±4 000mPas viscosity @  23°C /Reomat NSEG0013 680 ± 200 mPas
Volume weight ISO 2811   Volume weight ISO 2811 1,00 g/ml
Colour   brown Colour   yellow
Mixture A + B
Mixture weight ratio   100 /13 ± 1
Mixture volume ratio   100/17,7
Insert content   53%
viscosity @ 23°C /Reomat/ NSEG0013 1 800 ± 700 mPas
Volume weight ISO 2811 1,28 g/ml
lifetime 150g @ 23°C NSEG 0005 29 min
Gelation time @ 23° -150 g NSEG 0008 59 min
Gelation time @ 78°- 2,5 g NSEG 0012 7 min 30 s ± 3 min
Exothermic peak @50 g NSEG 0007 30 °C
Exothermic peak @ 100g NSEG 0007 30 °C
Exothermic peak @ 200g NSEG 0007 36 °C
 
Polymerisation
W20°C NSEG 0010  
W60°C NSEG 0010 45 min
 
Mechanical properties
Line shrinkage ISO 3521 < 1.0%
Stretch ISO R 527 210daN/cm2
Lengthen ISO R 527 <4%
Shore hardness A/D @ 23°C ISO 868 60 D
 
Electrical properties
Dielectric withstand CEI 243 20 kV/mm
Dielectric constant @ CEI 250 (50 Hz)
Tg d @ 23°C CEI 250 (50 Hz)
 
Thermal properties
Constant operation temperature   -40+155°C
Thermal conductance   0.60 ±0.1 W/m.°C
Glassy phase   41 °C
Self - extinguished SEG V0 6 mm
Less
Read more
Comments (0)