Materiales térmicamente conductores

DACPOL offers a wide range of thermal conductive materials. Our customers have known for many years that they can rely on the quality of our products. We constantly strive to make the ordering and purchasing process from our enclosure department as convenient as possible for our clients, which is why we offer the option to place orders online and by phone.

What are the basic parameters of thermal conductive materials?

The most important parameters characterizing thermal conductive materials are:

Thermal conductivity – This is the amount of energy transferred, which depends on the material and is proportional to the cross-sectional area of the barrier, the temperature difference, the flow time, and inversely proportional to the thickness of the barrier.

Thermal impedance – This is the temperature difference between the heat-generating component and the cooling component. The value of thermal impedance depends on the clamping force and the size and quality of the mating surfaces.

Additional factors to consider when designing systems are:

- Electrical resistance (insulation and resistance)
- Mechanical strength (fire and impact resistance)
- Average and maximum dissipated power
- Maximum operating temperature
- Cooling system efficiency
- Smoothness/porosity of the cooling surface.

What types of thermal conductive materials are there?

Thermal conductive adhesives – These are special adhesives designed to work in harsh conditions, so they do not melt or dry out, thus maintaining their properties. The use of these adhesives improves heat dissipation and additionally enhances the mounting of construction elements.

Gap fillers (GFL) – These are thermal mixtures that can be used for sealing devices and applying to heat sinks or enclosure covers. An important advantage is their ease of application, which allows for the protection of complex geometries. These materials are typically used to create what is known as a "thermal conductivity path."

Filling materials – These are gap fillers with specific geometry and mechanical and electrical properties that enable their use in various applications. They are designed to compensate for component unevenness and are used in pressure-sensitive applications.