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Features
• Optimized shear thinning*
• Stays in place, highly slump resistant
• Ultra-conforming, designed for fragile and low stress applications
• No cure by-products
Applications
• Automotive electronics
• Computers and peripherals
• Telecommunications
• Thermally conductive vibration dampening
• Between any heat-generating semiconductor and a heat sink
Specifications
Density (g/cc): 2.7
Hardness (Shore 00): 50
Dielectric Strength ( V/mil): 400
Thermal Conductivity: 1.8W/m-K
* ”Optimized Shear Thinning” - Maximizes dispensing capacity and equipment reliability.
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Features
• Optimized shear thinning*
• Stays in place, highly slump resistant
• Ultra-conforming, designed for fragile and low stress applications
• No cure by-products
Applications
• Automotive electronics
• Computers and peripherals
• Telecommunications
• Thermally conductive vibration dampening
• Between any heat-generating semiconductor and a heat sink
Specifications
Density (g/cc): 2.7
Hardness (Shore 00): 50
Dielectric Strength ( V/mil): 400
Thermal Conductivity: 1.8W/m-K
* ”Optimized Shear Thinning” - Maximizes dispensing capacity and equipment reliability.