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Features
• Low “S-Class” thermal resistance at very low pressures
• Highly conformable, “S-Class” softness
• Designed for low-stress applications
• Fiberglass reinforced for puncture, shear and tear resistance
Applications
• Processors
• Server S-RAMs
• Mass storage drives
• Wireline/wireless communications hardware
• Notebook computers
• BGA packages
• Power conversion
Specifications
Thickness: 0.010-0.125" (0.254-3.175mm)
Hardness, Bulk Rubber (Shore 00): 30
Dielectric Breakdown Voltage (Vac): >3000
Thermal Conductivity: 3.0W/m-K
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Features
• Low “S-Class” thermal resistance at very low pressures
• Highly conformable, “S-Class” softness
• Designed for low-stress applications
• Fiberglass reinforced for puncture, shear and tear resistance
Applications
• Processors
• Server S-RAMs
• Mass storage drives
• Wireline/wireless communications hardware
• Notebook computers
• BGA packages
• Power conversion
Specifications
Thickness: 0.010-0.125" (0.254-3.175mm)
Hardness, Bulk Rubber (Shore 00): 30
Dielectric Breakdown Voltage (Vac): >3000
Thermal Conductivity: 3.0W/m-K