Rellenos térmicos plásticos Pad Pad VO
  • Rellenos térmicos plásticos Pad Pad VO

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Fabricante: BERGQUIST

Rellenos térmicos plásticos Pad Pad VO

Features
• Highly conformable, low hardness
• “Gel-like” modulus
• Designed for low-stress applications
• Puncture, shear and tear resistant

Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader

Specifications
Thickness: 0.020-0.250" (0.508-6.350mm)
Hardness, Bulk Rubber (Shore 00): 5
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.0W/m-K

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Features
• Highly conformable, low hardness
• “Gel-like” modulus
• Designed for low-stress applications
• Puncture, shear and tear resistant

Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader

Specifications
Thickness: 0.020-0.250" (0.508-6.350mm)
Hardness, Bulk Rubber (Shore 00): 5
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.0W/m-K

Menos
Lee mas