Descripción general de los materiales de termocipación
  • Descripción general de los materiales de termocipación

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Fabricante: HENKEL (BERGQUIST)

Descripción general de los materiales de termocipación

Overview of thermally conductive materials

Product overviewInterface applications
Market ApplicationsProducts

Discrete Power Devices for Power Supplies, Computers, Telecom
(Thru-Hole)

Active Power Components:  Capacitors, Inductors, Resitors

Electronic Modules for Autmoative: Motor [&] Wiper Controls, Anti-Lock, etc.

Electronic Modules for Telecom and Power Supplies

Computer Applications: CPU, GPU, ASCIs, Hard Divers

Grease Replacement
Materials		 Q-Pad II T   T T T
Q-Pad 3 T   T T T
Hi-Flow 105 T     AS AS
Hi-Flow 300G T     T T
Hi-Flow 225F-AC T     T  
Hi-Flow 225UT         T
Hi-Flow 225U         T
Hi-Flow 565U       T T
Hi-Flow 565UT       T T
Grease Replacement
Materials - Insulated		 Hi-Flow 625 T        
Hi-Flow 300P T        
Hi-Flow 650P T        
Bonding - Thin Film Bond-Ply 660P T     T T
Bonding - Fiberglas Bond-Ply 100 T     T T
Bonding - Unreinforced Bond-Ply 400 T     T T
Sil-Pad – Fiberglas Sil-Pad 400 T   T T  
Sil-Pad 800 T   T T  
Sil-Pad 900S T   T T  
Sil-Pad 980     T T  
Sil-Pad 1 I00ST T   T T  
Sil-Pad 1200 T   T T  
Sil-Pad A1500 T   T T  
Sil-Pad I500ST T   T T  
Sil-Pad 2000 T   T T  
Sil-Pad A2000 T   T T  
Sil-Pad – Thin Film
Polymide		 Sil-Pad K-4 T   T T  
Sil-Pad K-6 T   T T  
Sil-Pad K-10 T   T T  
Gap Pad Gap Pad VO T T T T T
Gap Pad VO Soft T T T T T
Gap Pad VO Ultra Soft T T T T T
Gap Pad VO Ultimate T T T T T
Gap Pad I000SF T T T T T
Gap Pad HCI000 T T     T
Gap Pad 1500 T T     T
Gap Pad I500R T T T   T
Gap Pad I500S30 T T T T AS
Gap Pad A2000 T T   T AS
Gap Pad 2000S40 T T   T AS
Gap Pad 2200SF T T T T T
Gap Pad 2500S20 T T   T AS
Gap Pad 2500 T T   T AS
Gap Pad A3000 T T T T AS
Gap Pad 3000S30 T T T T AS
Gap Pad 5000S35 T T T T AS
Gap-Filler Gap Filler 1000   T T T  
Gap Filler 1100SF   T T T T
Gap Filler 1500   T T T  
Gap Filler 2000   T T T  
Gap Filler 3500S35   T T T  
Liquid Adhesive Liqui-Bond SA 1000 T   T    
Liqui-Bond SA 1800 T   T    
Liqui-Bond SA 2000 T   T    


Product overview Mounting Methods
Market ApplicationsProducts

Electrical Insulator

Clip, Low Pressure

Screw/Rivets, High Pressure

Not Applicable

Grease Replacement
Materials		 Q-Pad II   T T  
Q-Pad 3   T T  
Hi-Flow 105   T    
Hi-Flow 300G   T AS  
Hi-Flow 225F-AC   T    
Hi-Flow 225UT   T    
Hi-Flow 225U   T    
Hi-Flow 565U   T    
Hi-Flow 565UT   T    
Grease Replacement
Materials - Insulated		 Hi-Flow 625 T T    
Hi-Flow 300P T T    
Hi-Flow 650P T T    
Bonding - Thin Film Bond-Ply 660P T     T
Bonding - Fiberglas Bond-Ply 100 T     T
Bonding - Unreinforced Bond-Ply 400 T     T
Sil-Pad – Fiberglas Sil-Pad 400 T T T  
Sil-Pad 800 T T    
Sil-Pad 900S T T T  
Sil-Pad 980 T   T  
Sil-Pad 1 I00ST T T T  
Sil-Pad 1200 T T T  
Sil-Pad A1500 T T T  
Sil-Pad I500ST T T T  
Sil-Pad 2000 T AS    
Sil-Pad A2000 T AS T  
Sil-Pad – Thin Film
Polymide		 Sil-Pad K-4 T T T  
Sil-Pad K-6 T T T  
Sil-Pad K-10 T T T  
Gap Pad Gap Pad VO T T    
Gap Pad VO Soft T T    
Gap Pad VO Ultra Soft T T    
Gap Pad VO Ultimate T T    
Gap Pad I000SF T T    
Gap Pad HCI000 T T    
Gap Pad 1500 T T    
Gap Pad I500R T T    
Gap Pad I500S30 T T    
Gap Pad A2000 T T    
Gap Pad 2000S40 T T    
Gap Pad 2200SF T T    
Gap Pad 2500S20 T T    
Gap Pad 2500 T T    
Gap Pad A3000 T T    
Gap Pad 3000S30 T T    
Gap Pad 5000S35 T T    
Gap-Filler Gap Filler 1000 AS T    
Gap Filler 1100SF AS T    
Gap Filler 1500 AS T    
Gap Filler 2000 AS T    
Gap Filler 3500S35 AS T    
Liquid Adhesive Liqui-Bond SA 1000 AS     T
Liqui-Bond SA 1800 AS     T
Liqui-Bond SA 2000 AS     T

Product overviewTypical Converted optinos
Market ApplicationsProducts

Sheet Stock

Roll Form, Configurations

Standard Configurations

Custom External Shapes

Custom Internal Features

Standard PSA Offirings

Grease Replacement
Materials		 Q-Pad II A A A A A A
Q-Pad 3 A A A A A A
Hi-Flow 105 A A A A A A
Hi-Flow 300G A A A A A A
Hi-Flow 225F-AC A A A AS    
Hi-Flow 225UT AS A A AS    
Hi-Flow 225U AS A A AS    
Hi-Flow 565U AS A A AS    
Hi-Flow 565UT AS A A AS    
Grease Replacement
Materials - Insulated		 Hi-Flow 625 A A A A A A
Hi-Flow 300P A A A A A A
Hi-Flow 650P A A A A A  
Bonding - Thin Film Bond-Ply 660P A A A A A  
Bonding - Fiberglas Bond-Ply 100 A A A A A  
Bonding - Unreinforced Bond-Ply 400   A A A A  
Sil-Pad – Fiberglas Sil-Pad 400 A A A A A A
Sil-Pad 800 A A A A A A
Sil-Pad 900S A A A A A A
Sil-Pad 980 A A A A A A
Sil-Pad 1 I00ST A A A A A  
Sil-Pad 1200 A A A A A A
Sil-Pad A1500 A A A A A A
Sil-Pad I500ST A A A A A  
Sil-Pad 2000 A A A A A A
Sil-Pad A2000 A A A A A A
Sil-Pad – Thin Film
Polymide		 Sil-Pad K-4 A A A A A A
Sil-Pad K-6 A A A A A A
Sil-Pad K-10 A A A A A A
Gap Pad Gap Pad VO A A* A A AS A
Gap Pad VO Soft A A* A A AS A
Gap Pad VO Ultra Soft A A* A A AS A
Gap Pad VO Ultimate A   A A AS A
Gap Pad I000SF A   A A AS  
Gap Pad HCI000 A A* A A A  
Gap Pad 1500 A A* A A AS  
Gap Pad I500R A A* A A A  
Gap Pad I500S30 A   A A A  
Gap Pad A2000 A A* A A A  
Gap Pad 2000S40 A   A A A  
Gap Pad 2200SF A   A A AS  
Gap Pad 2500S20 A   A A A  
Gap Pad 2500 A   A A A  
Gap Pad A3000 A A* A A A  
Gap Pad 3000S30 A   A A A  
Gap Pad 5000S35     A A A  
Gap-Filler Gap Filler 1000     NA      
Gap Filler 1100SF     NA      
Gap Filler 1500     NA      
Gap Filler 2000     NA      
Gap Filler 3500S35     NA      
Liquid Adhesive Liqui-Bond SA 1000     NA      
Liqui-Bond SA 1800     NA      
Liqui-Bond SA 2000     NA      

T = Typical, AS = Application-Specific (contact Berqquist Sales); A= Avilable; * = Roll stock configurations are limited – contact yout Bergquist Sales Representative for more information.
Note: For Hi-Flow 225UT, 225F0AC and Hi-Flow 565UT, the adhesive is not a pressure sensitive adhersie (PSA).

Thermal gasket Sil-Pad 900S

Features and Benefits

  • Thermal impedance: 0.61°C-in2 /W (@50 psi)
  • Electrically isolating
  • Low mounting pressures
  • Smooth and highly compliant surface
    General-purpose thermal interface material solutio

Typical Applications Include:

  • Power supplies
  • Automotive electronics
  • Motor controls
  • Power semiconductors

Specification:

  • thickness: 0,229 mm
  • dielecric breakdown voltage (Vac): 5500
  • thermal conductivity: 1,5 W/m x K
  • reinforcement carrier: fiberglass

Podkładka termoprzewodząca Sil-Pad 900S

 

Thermal gasket Sil-Pad 1100ST

Features and Benefits

  • Inherent tack on both sides for exceptional thermal performance and easy placement
  • Re-positionable for higher utilization, ease of use and assembly error reduction
  • Lined on both sides for ease of handling prior to placement in high volume assemblies
  • Exhibits exceptional thermal performance even at a low mounting pressure
  • Fiberglass reinforced
  • Value alternative to Sil-Pad 1500ST

Typical Applications Include:

  • Automotive ECMs
  • Motor controls
  • Power supplies
  • Between an electronic power device and its heat sink

Specification:

  • thickness: 0,305 mm
  • dielectic breakdowsn voltage (Vac): 5000
  • thermal conductivity: 1,1 W/m x K
  • reinforcement carrier


Przegląd materiałów termoprzewodzących

 

Thermal gasket Sil-Pad 1200

Features and Benefits

  • Thermal Impedance: 0.53O C-in2 /W (@ 50 psi)
  • Exceptional thermal performance at lower
    application pressures
  • Smooth and non-tacky on both sides for easy re-positioning, ease of use and assem-bly error reduction
  • Superior breakdown voltage and surface “wet out” values
  • Designed for applications where electrical isolation is critical
  • Excellent cut-through resistance, designed for screw and clip mounted applications

Typical Applications Include:

  • Automotive electronics control modules
  • Power supplies
  • Motor controls
  • Audio amplifiers
  • Discrete devices
  • Telecommunications

Specification:

  • thickness 0,305 mm
  • dielectric breakdown voltage(Vac): 5000
  • thermal conductivity: 1,1 W/m x K
  • reinforcement carrier: Fiberglass

Podkładka termoprzewodząca Sil-Pad 1200

 

Thermal gasket Sil-Pad K-10

Features and Benefits

  • Thermal impedance: 0.41°C-in 2 /W (@50 psi)
  • Tough dielectric barrier against cut-through
  • High performance film
  • Designed to replace ceramic insulators

Typical Applications Include:

  • Power supplies
  • Motor controls
  • Power semiconductors

Specification:

  • thickness: 0,152 mm
  • dielectric breakdwond voltage (Vac): 6000
  • thermal conductivity: 1,3 W/m x K
  • reinforcement carrier

Podkładka termoprzewodząca Sil-Pad K-10

 

Thermal gasket Sil-Pad 1500A

Features and Benefits

  • Thermal impedance: 0.42°C-in 2 /W (@50 psi)
  • Elastomeric compound coated on both sides

Typical Applications Include:

  • Power supplies
  • Automotive electronics
  • Motor controls
  • Power semiconductors

Specification:

  • thickness: 0,254 mm
  • dielectric Breakdown Voltage (Vac): 6000
  • thermal Conductivity: 2,0 W/m x K
  • Reinforcement Carrier: Fiberglass

Podkładki termoprzewodzące Sil-Pad 1500A

 

Thermal gasket Q-Pad 3

Features and Benefits

  • Thermal impedance: 0.35°C-in 2 /W (@50 psi)
  • Eliminates processing constraints typically associated with grease
  • Conforms to surface textures
  • Easy handling
  • May be installed prior to soldering and cleaning without worry

Typical Applications Include:

  • Between a transistor and a heat sink
  • Between two large surfaces such as an L-bracket and the chassis of an assembly
  • Between a heat sink and a chassis
  • Under electrically isolated power modules or devices such as resistors, transformers and solid state relays

Specification:

  • reinforcement carrier: 0,127 mm
  • dielectric breakdown voltage (Vac): Non-Insulating
  • thermal Conductivity: 2,0 W/m x K
  • Reinforcement Carrier: Fiberglass

Podkładki termoprzewodzące Q-Pad 3

 

Uwaga:
Każdy wyżej wymieniony materiał może zostać dostosowany do kształtów wymaganych przez klienta. W tym celu prosimy o kontakt z działem technicznym DACPOL Sp. z o.o.

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Overview of thermally conductive materials

Product overviewInterface applications
Market ApplicationsProducts

Discrete Power Devices for Power Supplies, Computers, Telecom
(Thru-Hole)

Active Power Components:  Capacitors, Inductors, Resitors

Electronic Modules for Autmoative: Motor [&] Wiper Controls, Anti-Lock, etc.

Electronic Modules for Telecom and Power Supplies

Computer Applications: CPU, GPU, ASCIs, Hard Divers

Grease Replacement
Materials		 Q-Pad II T   T T T
Q-Pad 3 T   T T T
Hi-Flow 105 T     AS AS
Hi-Flow 300G T     T T
Hi-Flow 225F-AC T     T  
Hi-Flow 225UT         T
Hi-Flow 225U         T
Hi-Flow 565U       T T
Hi-Flow 565UT       T T
Grease Replacement
Materials - Insulated		 Hi-Flow 625 T        
Hi-Flow 300P T        
Hi-Flow 650P T        
Bonding - Thin Film Bond-Ply 660P T     T T
Bonding - Fiberglas Bond-Ply 100 T     T T
Bonding - Unreinforced Bond-Ply 400 T     T T
Sil-Pad – Fiberglas Sil-Pad 400 T   T T  
Sil-Pad 800 T   T T  
Sil-Pad 900S T   T T  
Sil-Pad 980     T T  
Sil-Pad 1 I00ST T   T T  
Sil-Pad 1200 T   T T  
Sil-Pad A1500 T   T T  
Sil-Pad I500ST T   T T  
Sil-Pad 2000 T   T T  
Sil-Pad A2000 T   T T  
Sil-Pad – Thin Film
Polymide		 Sil-Pad K-4 T   T T  
Sil-Pad K-6 T   T T  
Sil-Pad K-10 T   T T  
Gap Pad Gap Pad VO T T T T T
Gap Pad VO Soft T T T T T
Gap Pad VO Ultra Soft T T T T T
Gap Pad VO Ultimate T T T T T
Gap Pad I000SF T T T T T
Gap Pad HCI000 T T     T
Gap Pad 1500 T T     T
Gap Pad I500R T T T   T
Gap Pad I500S30 T T T T AS
Gap Pad A2000 T T   T AS
Gap Pad 2000S40 T T   T AS
Gap Pad 2200SF T T T T T
Gap Pad 2500S20 T T   T AS
Gap Pad 2500 T T   T AS
Gap Pad A3000 T T T T AS
Gap Pad 3000S30 T T T T AS
Gap Pad 5000S35 T T T T AS
Gap-Filler Gap Filler 1000   T T T  
Gap Filler 1100SF   T T T T
Gap Filler 1500   T T T  
Gap Filler 2000   T T T  
Gap Filler 3500S35   T T T  
Liquid Adhesive Liqui-Bond SA 1000 T   T    
Liqui-Bond SA 1800 T   T    
Liqui-Bond SA 2000 T   T    


Product overview Mounting Methods
Market ApplicationsProducts

Electrical Insulator

Clip, Low Pressure

Screw/Rivets, High Pressure

Not Applicable

Grease Replacement
Materials		 Q-Pad II   T T  
Q-Pad 3   T T  
Hi-Flow 105   T    
Hi-Flow 300G   T AS  
Hi-Flow 225F-AC   T    
Hi-Flow 225UT   T    
Hi-Flow 225U   T    
Hi-Flow 565U   T    
Hi-Flow 565UT   T    
Grease Replacement
Materials - Insulated		 Hi-Flow 625 T T    
Hi-Flow 300P T T    
Hi-Flow 650P T T    
Bonding - Thin Film Bond-Ply 660P T     T
Bonding - Fiberglas Bond-Ply 100 T     T
Bonding - Unreinforced Bond-Ply 400 T     T
Sil-Pad – Fiberglas Sil-Pad 400 T T T  
Sil-Pad 800 T T    
Sil-Pad 900S T T T  
Sil-Pad 980 T   T  
Sil-Pad 1 I00ST T T T  
Sil-Pad 1200 T T T  
Sil-Pad A1500 T T T  
Sil-Pad I500ST T T T  
Sil-Pad 2000 T AS    
Sil-Pad A2000 T AS T  
Sil-Pad – Thin Film
Polymide		 Sil-Pad K-4 T T T  
Sil-Pad K-6 T T T  
Sil-Pad K-10 T T T  
Gap Pad Gap Pad VO T T    
Gap Pad VO Soft T T    
Gap Pad VO Ultra Soft T T    
Gap Pad VO Ultimate T T    
Gap Pad I000SF T T    
Gap Pad HCI000 T T    
Gap Pad 1500 T T    
Gap Pad I500R T T    
Gap Pad I500S30 T T    
Gap Pad A2000 T T    
Gap Pad 2000S40 T T    
Gap Pad 2200SF T T    
Gap Pad 2500S20 T T    
Gap Pad 2500 T T    
Gap Pad A3000 T T    
Gap Pad 3000S30 T T    
Gap Pad 5000S35 T T    
Gap-Filler Gap Filler 1000 AS T    
Gap Filler 1100SF AS T    
Gap Filler 1500 AS T    
Gap Filler 2000 AS T    
Gap Filler 3500S35 AS T    
Liquid Adhesive Liqui-Bond SA 1000 AS     T
Liqui-Bond SA 1800 AS     T
Liqui-Bond SA 2000 AS     T

Product overviewTypical Converted optinos
Market ApplicationsProducts

Sheet Stock

Roll Form, Configurations

Standard Configurations

Custom External Shapes

Custom Internal Features

Standard PSA Offirings

Grease Replacement
Materials		 Q-Pad II A A A A A A
Q-Pad 3 A A A A A A
Hi-Flow 105 A A A A A A
Hi-Flow 300G A A A A A A
Hi-Flow 225F-AC A A A AS    
Hi-Flow 225UT AS A A AS    
Hi-Flow 225U AS A A AS    
Hi-Flow 565U AS A A AS    
Hi-Flow 565UT AS A A AS    
Grease Replacement
Materials - Insulated		 Hi-Flow 625 A A A A A A
Hi-Flow 300P A A A A A A
Hi-Flow 650P A A A A A  
Bonding - Thin Film Bond-Ply 660P A A A A A  
Bonding - Fiberglas Bond-Ply 100 A A A A A  
Bonding - Unreinforced Bond-Ply 400   A A A A  
Sil-Pad – Fiberglas Sil-Pad 400 A A A A A A
Sil-Pad 800 A A A A A A
Sil-Pad 900S A A A A A A
Sil-Pad 980 A A A A A A
Sil-Pad 1 I00ST A A A A A  
Sil-Pad 1200 A A A A A A
Sil-Pad A1500 A A A A A A
Sil-Pad I500ST A A A A A  
Sil-Pad 2000 A A A A A A
Sil-Pad A2000 A A A A A A
Sil-Pad – Thin Film
Polymide		 Sil-Pad K-4 A A A A A A
Sil-Pad K-6 A A A A A A
Sil-Pad K-10 A A A A A A
Gap Pad Gap Pad VO A A* A A AS A
Gap Pad VO Soft A A* A A AS A
Gap Pad VO Ultra Soft A A* A A AS A
Gap Pad VO Ultimate A   A A AS A
Gap Pad I000SF A   A A AS  
Gap Pad HCI000 A A* A A A  
Gap Pad 1500 A A* A A AS  
Gap Pad I500R A A* A A A  
Gap Pad I500S30 A   A A A  
Gap Pad A2000 A A* A A A  
Gap Pad 2000S40 A   A A A  
Gap Pad 2200SF A   A A AS  
Gap Pad 2500S20 A   A A A  
Gap Pad 2500 A   A A A  
Gap Pad A3000 A A* A A A  
Gap Pad 3000S30 A   A A A  
Gap Pad 5000S35     A A A  
Gap-Filler Gap Filler 1000     NA      
Gap Filler 1100SF     NA      
Gap Filler 1500     NA      
Gap Filler 2000     NA      
Gap Filler 3500S35     NA      
Liquid Adhesive Liqui-Bond SA 1000     NA      
Liqui-Bond SA 1800     NA      
Liqui-Bond SA 2000     NA      

T = Typical, AS = Application-Specific (contact Berqquist Sales); A= Avilable; * = Roll stock configurations are limited – contact yout Bergquist Sales Representative for more information.
Note: For Hi-Flow 225UT, 225F0AC and Hi-Flow 565UT, the adhesive is not a pressure sensitive adhersie (PSA).

Thermal gasket Sil-Pad 900S

Features and Benefits

  • Thermal impedance: 0.61°C-in2 /W (@50 psi)
  • Electrically isolating
  • Low mounting pressures
  • Smooth and highly compliant surface
    General-purpose thermal interface material solutio

Typical Applications Include:

  • Power supplies
  • Automotive electronics
  • Motor controls
  • Power semiconductors

Specification:

  • thickness: 0,229 mm
  • dielecric breakdown voltage (Vac): 5500
  • thermal conductivity: 1,5 W/m x K
  • reinforcement carrier: fiberglass

Podkładka termoprzewodząca Sil-Pad 900S

 

Thermal gasket Sil-Pad 1100ST

Features and Benefits

  • Inherent tack on both sides for exceptional thermal performance and easy placement
  • Re-positionable for higher utilization, ease of use and assembly error reduction
  • Lined on both sides for ease of handling prior to placement in high volume assemblies
  • Exhibits exceptional thermal performance even at a low mounting pressure
  • Fiberglass reinforced
  • Value alternative to Sil-Pad 1500ST

Typical Applications Include:

  • Automotive ECMs
  • Motor controls
  • Power supplies
  • Between an electronic power device and its heat sink

Specification:

  • thickness: 0,305 mm
  • dielectic breakdowsn voltage (Vac): 5000
  • thermal conductivity: 1,1 W/m x K
  • reinforcement carrier


Przegląd materiałów termoprzewodzących

 

Thermal gasket Sil-Pad 1200

Features and Benefits

  • Thermal Impedance: 0.53O C-in2 /W (@ 50 psi)
  • Exceptional thermal performance at lower
    application pressures
  • Smooth and non-tacky on both sides for easy re-positioning, ease of use and assem-bly error reduction
  • Superior breakdown voltage and surface “wet out” values
  • Designed for applications where electrical isolation is critical
  • Excellent cut-through resistance, designed for screw and clip mounted applications

Typical Applications Include:

  • Automotive electronics control modules
  • Power supplies
  • Motor controls
  • Audio amplifiers
  • Discrete devices
  • Telecommunications

Specification:

  • thickness 0,305 mm
  • dielectric breakdown voltage(Vac): 5000
  • thermal conductivity: 1,1 W/m x K
  • reinforcement carrier: Fiberglass

Podkładka termoprzewodząca Sil-Pad 1200

 

Thermal gasket Sil-Pad K-10

Features and Benefits

  • Thermal impedance: 0.41°C-in 2 /W (@50 psi)
  • Tough dielectric barrier against cut-through
  • High performance film
  • Designed to replace ceramic insulators

Typical Applications Include:

  • Power supplies
  • Motor controls
  • Power semiconductors

Specification:

  • thickness: 0,152 mm
  • dielectric breakdwond voltage (Vac): 6000
  • thermal conductivity: 1,3 W/m x K
  • reinforcement carrier

Podkładka termoprzewodząca Sil-Pad K-10

 

Thermal gasket Sil-Pad 1500A

Features and Benefits

  • Thermal impedance: 0.42°C-in 2 /W (@50 psi)
  • Elastomeric compound coated on both sides

Typical Applications Include:

  • Power supplies
  • Automotive electronics
  • Motor controls
  • Power semiconductors

Specification:

  • thickness: 0,254 mm
  • dielectric Breakdown Voltage (Vac): 6000
  • thermal Conductivity: 2,0 W/m x K
  • Reinforcement Carrier: Fiberglass

Podkładki termoprzewodzące Sil-Pad 1500A

 

Thermal gasket Q-Pad 3

Features and Benefits

  • Thermal impedance: 0.35°C-in 2 /W (@50 psi)
  • Eliminates processing constraints typically associated with grease
  • Conforms to surface textures
  • Easy handling
  • May be installed prior to soldering and cleaning without worry

Typical Applications Include:

  • Between a transistor and a heat sink
  • Between two large surfaces such as an L-bracket and the chassis of an assembly
  • Between a heat sink and a chassis
  • Under electrically isolated power modules or devices such as resistors, transformers and solid state relays

Specification:

  • reinforcement carrier: 0,127 mm
  • dielectric breakdown voltage (Vac): Non-Insulating
  • thermal Conductivity: 2,0 W/m x K
  • Reinforcement Carrier: Fiberglass

Podkładki termoprzewodzące Q-Pad 3

 

Uwaga:
Każdy wyżej wymieniony materiał może zostać dostosowany do kształtów wymaganych przez klienta. W tym celu prosimy o kontakt z działem technicznym DACPOL Sp. z o.o.

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