Pâtes thermoconductrices

Thermal paste is a substance used to improve thermal conductivity between two surfaces. It is particularly...

Afficher les filtres
Masquer les filtresFiltrationAfficher les filtres X
Manufacturers
more... less
épaisseur du mur
more... less
Isolation
more... less
Rth (K/W)
more... less
more... less
Filter
Information close
Les produits marqués «En commande» dans la colonne «Quantité disponible» ne sont généralement pas en stock. Ces produits sont disponibles à l'achat, cependant, en raison de leur clientèle limitée, ils ont généralement des quantités minimales plus élevées. DACPOL propose des produits qui ne sont pas en stock pour les raisons suivantes: DACPOL a actuellement un grand nombre de composants électroniques en stock et ajoute de nouveaux produits chaque jour, cependant, des dizaines de milliers de composants supplémentaires et leurs différentes variantes sont disponibles chez nos fournisseurs. Même s'il n'est pas raisonnable d'avoir tous ces produits en stock en raison des ventes limitées, nous pensons qu'il est dans le meilleur intérêt de nos clients de les rendre disponibles. Notre objectif est d'informer les clients sur le nombre maximum de produits disponibles et de leur permettre de prendre des décisions en fonction des spécifications, des prix, de la disponibilité, des minimums requis et de nos conseils techniques. Veuillez noter que la sélection de la case à cocher «En stock» peut limiter l'affichage aux seuls produits disponibles à la livraison directement en rayon.
Résultats par page:

Thermal paste is a substance used to improve thermal conductivity between two surfaces. It is particularly useful in electronic applications, where it can be applied between a processor and a heatsink or between other electronic components and radiators or heat sinks.

Thermal paste works by filling microscopic gaps and irregularities on surfaces, eliminating the layer of air that would act as a thermal insulator. This improves the contact between electronic components and cooling systems, resulting in more efficient heat dissipation. As a result, stable operating temperatures for electronic components can be maintained, which is crucial for their performance and durability.

Thermal paste is used in various fields, primarily in electronics, to enhance thermal conductivity between two surfaces. Here are the main applications of thermal pastes:

  1. Cooling computer processors: In personal computers and other electronic devices, thermal pastes are applied between the processor and a heatsink or cooling system. This helps efficiently transfer heat from the processor to the cooling system, preventing the system from overheating.

  2. Integrated circuits (ICs): For components like integrated circuits that generate heat during operation, thermal pastes are used to improve heat conduction between the IC and radiators or heat sinks.

  3. Laptops and mobile devices: In portable devices such as laptops, smartphones, and tablets, thermal pastes aid in effectively cooling processors and other components that may generate significant heat.

  4. LED light sources: In LED lighting applications, where light-emitting diodes can generate heat, thermal pastes assist in efficient heat dissipation, affecting the performance and longevity of the LEDs.

  5. Automotive electronics: In cars and other vehicles, thermal pastes are used in electronic systems to provide effective cooling in varying temperature conditions.

  6. Industrial applications: In the industry, especially in the production of electronics, thermal pastes are utilized in various applications such as solar panels, medical devices, and telecommunications systems.

Thermal pastes vary in chemical composition and properties. They often contain thermally conductive substances such as metal or ceramics, combined with a carrier (e.g., silicone). The choice of the right paste depends on the specific application, the type of electronic components involved, and thermal conductivity requirements. It is advisable to check the manufacturer's specifications and application recommendations.