Résine à deux composants sans JBR19.4 + D19.4, polymérisation à la température ambiante
  • Résine à deux composants sans JBR19.4 + D19.4, polymérisation à la température ambiante

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Fabricant: SEG

Résine à deux composants sans JBR19.4 + D19.4, polymérisation à la température ambiante

Application:
-Half hard resin is used in electro technical and electronic industry..
Main characteristic:
- epoxide two component resin with good thermal conductance, compatible with insulation systems class F.

Polymerisation:
- polymerisation is complete after 47h in temperature 20°C,
- it is recommended to heat up for an hour to temperature 50C after polymerization to obtain optimal parameters.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Storage conditions:
-6 months in original closed container, in temperature 10°C - 25 °C.

Packing:
- in containers 1, 5 i 20 kg and barrels 200 kg,
- part B is delivered in corresponding proportion to part A.

 
Preliminary polymer part A Hardener part B
viscosity @ 23°C   624 mPas viscosity @ 23°C   19 mPas
Reomat 108 E/R speed 50s+1 Reomat 108 E/R   190s+1
Volume weight   1,09 g/ml Volume weight   0,89 g/ml
Colour   transparent     yellow
Mixture A + B
Mixture weight ratio   100/20
Mixture volume ratio   80/20
Insert content   0%
viscosity @ 23°C   855 mPas
Reomat 108 E/R speed 50s+1
Volume weight   1,06 g/ml
lifetime  150 g @ 23°C   106 min
Gelation time @ 121°C   3min ± 30s
Exothermic peak @ 50 g   27 °C
Exothermic peak @ 100 g   28 °C
Exothermic peak @ 200 g   35 °C
Polymerisation
W20°C   18 h
W100°C   1 h30 min
Mechanical properties
Line shrinkage ISO 3521 %
Break off resistance ISO R 527 157 daN/cm2
Lengthening during break off ISO R 527 48,7 %
Shore hardness A/D @ 23°C ISO 868 D61
 
Electrical properties
Dielectric withstand CEI 243 20 kV/mm
 
Thermal properties
Constant operation temperature   od-30 do 155 °C
Self - extinguished UL 94 no
Moins
Lire la suite

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Application:
-Half hard resin is used in electro technical and electronic industry..
Main characteristic:
- epoxide two component resin with good thermal conductance, compatible with insulation systems class F.

Polymerisation:
- polymerisation is complete after 47h in temperature 20°C,
- it is recommended to heat up for an hour to temperature 50C after polymerization to obtain optimal parameters.

Protection and hygiene:
- Resin components don't corrode.
- it is prohibited to touch with skin, or inhale
- it is recommended to use gloves, glasses and mask.

Storage conditions:
-6 months in original closed container, in temperature 10°C - 25 °C.

Packing:
- in containers 1, 5 i 20 kg and barrels 200 kg,
- part B is delivered in corresponding proportion to part A.

 
Preliminary polymer part A Hardener part B
viscosity @ 23°C   624 mPas viscosity @ 23°C   19 mPas
Reomat 108 E/R speed 50s+1 Reomat 108 E/R   190s+1
Volume weight   1,09 g/ml Volume weight   0,89 g/ml
Colour   transparent     yellow
Mixture A + B
Mixture weight ratio   100/20
Mixture volume ratio   80/20
Insert content   0%
viscosity @ 23°C   855 mPas
Reomat 108 E/R speed 50s+1
Volume weight   1,06 g/ml
lifetime  150 g @ 23°C   106 min
Gelation time @ 121°C   3min ± 30s
Exothermic peak @ 50 g   27 °C
Exothermic peak @ 100 g   28 °C
Exothermic peak @ 200 g   35 °C
Polymerisation
W20°C   18 h
W100°C   1 h30 min
Mechanical properties
Line shrinkage ISO 3521 %
Break off resistance ISO R 527 157 daN/cm2
Lengthening during break off ISO R 527 48,7 %
Shore hardness A/D @ 23°C ISO 868 D61
 
Electrical properties
Dielectric withstand CEI 243 20 kV/mm
 
Thermal properties
Constant operation temperature   od-30 do 155 °C
Self - extinguished UL 94 no
Moins
Lire la suite
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