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Here are some essential points to consider when designing devices with EMC in mind:

Mitsubishi Electric has several years of experience and a long development history of 1700V modules for railway application from the start of this century. This year MITSUBISHI ELECTRIC has released the latest generation of 1700V IGBT power modules called X-Series that satisfies requirements of railway applications. Fig. 1 shows the historical evolution of the 1700V HVIGBT modules indicating the continuous reduction of the IGBT forward voltage. The IGBT forward voltage contributes to the...

The power electronics is exposed to extreme environmental conditions during the operation like dust, temperature, humidity, vibrations or chemicals. The mission profile of the temperature and relative humidity has a wide range dependent on application and the location of operation.

Modern electronic devices are used in various environments, exposed to different working conditions, and their reliability is of utmost importance to users. Here are several factors that impact the reliability and durability of electronic devices:

The switching frequency in those applications is usually higher than 20kHz, thus exceeding the range for which standard industrial IGBTmodules are optimized for. Since several years Mitsubishi Electric is offering a dedicated IGBT-series for those high frequency applications, called NFH-series. For reducing the switching loss it is using IGBT-chips with an optimized trade-off between Vce(sat) and Eoff. As next innovation step Mitsubishi Electric now is introducing it’s Silicon Carbide Chip...

Proper circuit design and layout aim to minimize electromagnetic interference emissions and ensure immunity to external interferences. Here are some key aspects of circuit design and layout related to EMC:

The reduction of carbon dioxide and the responsible use of electric energy are main drivers for a more sustainable future society. Silicon Carbide (SiC) and its superior physical properties shall save even more electric energy and make power-electronic converters more compact, which reduces the consumption of valuable materials and resources.

In 2015, a consortium of train manufacturers and electric-equipment suppliers started discussions about the future of rolling stocks and radical innovations in the field of railway vehicles. The discussions, as part of the Horizon 2020 Project Roll2Rail, resulted also in technical requirements of tomorrow’s power semiconductor modules. These shall provide:

Electromagnetic emission refers to the process in which electronic devices generate and emit unwanted electromagnetic signals into the environment. On the other hand, electromagnetic immunity refers to the impact of electromagnetic disturbances from external sources on the operation of electronic devices.

Mitsubishi Electric has introduced the new G1 series Intelligent Power Modules (IPM) with an advanced Si-IGBT design to address several key performance parameters and enable the end-user to achieve high system performance. The advancements in the G1 IPM chip technology are aimed at resolving some inherent drawback of the Si-IGBT especially when it is employed for motor control applications. The G1 IPM device has been developed by implementing some key advancements in the latest 7th generation...

Electromagnetic Compatibility (EMC) is an essential aspect of designing, manufacturing, and using electronic devices. To ensure consistent standards and minimize electromagnetic interference within the European Union, a series of regulations concerning EMC have been introduced. Here is an overview of the main regulations and EMC standards in the European Union:

The current imbalance during module operation can be caused both by the characteristics of the paralleled power modules, such as the different forward voltage and by the design of the power converter itself. The interface of power modules, such as power connection on DC and AC side, the design of gate driver, and the gate driver connection to the power modules, have an influence on static and dynamic current imbalance of modules connected in parallel. An overview of the various factors that...

Applications such as small drives (in the range of 100W output power) have certain special requirements with regards to the design of the power supply unit. The power supply unit encompasses the power semiconductor module and the associated peripheries (such as gatedrive, control, protection and heatsink) which are assembled using a single PCB. This unit must be able to deliver the highest possible efficiency and must offer a high degree of compactness. Additionally, it is expected that the...

Electromagnetic interference refers to unwanted electromagnetic signals that can affect the operation of electronic devices and systems. They come in various forms such as radio waves, electromagnetic pulses, electrical surges, or conducted disturbances.

Industrial IGBT Modules are used in various fields of applications. All those applications require compact power modules with high power density, high reliability and high efficiency with reasonable cost. To fulfill all these requirements, the 7th Gen. NX-type IGBT Modules based on SLC-Technology have been developed. The 7th Gen. IGBT, which is based on CSTBT™ concept, provides high efficiency by the reduction of dynamic and static losses [2]. The loss reduction is the first step to realize a...

Electromagnetic Compatibility (EMC) is a field of science and engineering that deals with preventing electromagnetic interference and ensuring that electronic devices and systems can operate alongside each other without mutual electromagnetic interference. In short, EMC concerns the ability of devices to function in environments with various sources of electromagnetic disturbances and minimize their impact on other devices.

As a consequence the employment of reverse conducting IGBT chips save space and that resulted in the new package of the SLIMDIP being designed very compact. The SLIMDIP provides protection functions for under voltage, short circuit and over temperature as well as a linear output signal for the case temperature. The interface circuit of the SLIMDIP is 3,3V to 5V compliant and the pin terminal assignment simplifies the printed circuit board layout design.

The 7th gen. 650V and 1200V class Industrial IGBT modules have been introduced recently to the market. In this new IGBT module generation, the latest chip technology has been utilized [1] to cover the requirements of industrial power electronics applications. All those applications utilize the superior characteristics of the 7th gen NX-Type IGBT modules which are - compactness, high power density, high reliability, high efficiency and reasonable cost [2]. To expand the area of applicability...