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The above module has a standard housing commonly found on the market. Module is characterized by low losses when working at high temperatures. The module structure is pressed by the main spring against the base plate instead of a soldered joint. This design has better properties and ensures a longer life of the semiconductor.
Part number | URRM [V] | IFAV [A] | Configuration |
---|---|---|---|
5SET 0540T1800 | 1800 | 542 | TT |
5SEG 0540T1820 | 1800 | 542 | TD |
5SEE 0540T1830 | 1800 | 542 | DT |
5SED 0890T2240 | 2200 | 889 | DD |
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The above module has a standard housing commonly found on the market. Module is characterized by low losses when working at high temperatures. The module structure is pressed by the main spring against the base plate instead of a soldered joint. This design has better properties and ensures a longer life of the semiconductor.
Part number | URRM [V] | IFAV [A] | Configuration |
---|---|---|---|
5SET 0540T1800 | 1800 | 542 | TT |
5SEG 0540T1820 | 1800 | 542 | TD |
5SEE 0540T1830 | 1800 | 542 | DT |
5SED 0890T2240 | 2200 | 889 | DD |
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