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Thermal compounds can be used to encapsulate entire applications and apply to covers of enclosures or heat sinks. Thanks to their ease of use, they allow the encapsulation of even the most complex geometries.
Material | Thermal conductivity | Viscosity | Dielectric breakdown | Density | Hardness |
---|---|---|---|---|---|
W/mK | Pas | kV/mm | g/cm3 | Shore 00 | |
GFL 3040 | 4.3 | 55-85 | 10 | 3.1 | 65-85 |
GFL 3030 | 3.0 | 50-80 | 12 | 2.9* | 65-85 |
GFL 3025 | 2.5 | 30-60 | 16 | 2.83 | 65-85 |
GFL 3020 | 1.8 | 45-70 | 20 | 2.3 | 45-60 |
GFL 1800 SL (low viscosity) | 1.8 | 2-7 | 15 | 2.3 | 55-75 |
GFU 15 (silicone free) | 1.5 | 140-160 | 16 | 2.3 | 65-85 |
(*) Rounded values.
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trebuie să fii logat
Thermal compounds can be used to encapsulate entire applications and apply to covers of enclosures or heat sinks. Thanks to their ease of use, they allow the encapsulation of even the most complex geometries.
Material | Thermal conductivity | Viscosity | Dielectric breakdown | Density | Hardness |
---|---|---|---|---|---|
W/mK | Pas | kV/mm | g/cm3 | Shore 00 | |
GFL 3040 | 4.3 | 55-85 | 10 | 3.1 | 65-85 |
GFL 3030 | 3.0 | 50-80 | 12 | 2.9* | 65-85 |
GFL 3025 | 2.5 | 30-60 | 16 | 2.83 | 65-85 |
GFL 3020 | 1.8 | 45-70 | 20 | 2.3 | 45-60 |
GFL 1800 SL (low viscosity) | 1.8 | 2-7 | 15 | 2.3 | 55-75 |
GFU 15 (silicone free) | 1.5 | 140-160 | 16 | 2.3 | 65-85 |
(*) Rounded values.
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