![Thermally Conductive Filling Materials Gap Pad 1500R Thermally Conductive Filling Materials Gap Pad 1500R](https://www.dacpol.eu/20119-large_default/thermally-conductive-filling-materials-gap-pad-1500r.jpg)
![Thermally Conductive Filling Materials Gap Pad 1500R Thermally Conductive Filling Materials Gap Pad 1500R](https://www.dacpol.eu/20119-large_default/thermally-conductive-filling-materials-gap-pad-1500r.jpg)
Ви повинні увійти в систему
Фотографії призначені тільки для інформаційних цілей. Подивитися специфікацію продукту
please use latin characters
Features
• Fiberglass reinforced for puncture, shear and tear resistance
• Easy release construction
• Electrically isolating
Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• RDRAM memory modules / chip scale packages
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader
Specifications
Thickness: 0.010-0.020" (0.254-0.508mm)
Hardness, Bulk Rubber (Shore 00): 40
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.5W/m-K
Ви зацікавлені у цьому продукті? Вам потрібна додаткова інформація або індивідуальні розцінки?
Ви повинні увійти в систему
Features
• Fiberglass reinforced for puncture, shear and tear resistance
• Easy release construction
• Electrically isolating
Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• RDRAM memory modules / chip scale packages
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader
Specifications
Thickness: 0.010-0.020" (0.254-0.508mm)
Hardness, Bulk Rubber (Shore 00): 40
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.5W/m-K